IP Library Granted Patent US 6,562,734
Granted Patent Utility
US 6,562,734 · Confirmation No. 7014

METHOD OF FILLING GAPS ON A SEMICONDUCTOR WAFER

Inventor: Markus Kirchhoff
⬇ PDF
Code Description Pages PDF
2001-09-17 TRNA Transmittal of New Application 1 View
2001-09-17 SPEC Specification 14 View
2001-09-17 CLM Claims 3 View
2001-09-17 ABST Abstract 1 View
2001-09-17 DRW Drawings-only black and white line drawings 2 View
2001-09-17 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,562,734
App. No.
09/954,414
Filed
2001-09-17
Granted
2003-05-13
Pub. No.
US20020042186A1
Art Unit
2823
PTA
-5 days