CMOS image sensor and method of manufacturing the same
View Patent ↗There is provided a CMOS image sensor comprises a LOCOS isolation film 6 formed on the surface of a semiconductor substrate 100 containing a peripheral circuit 31 and a photodiode region 15 , a gate electrode 1 formed on the surface of the peripheral circuit 31 , a surface-protecting film 8 deposited on at least a portion of the photodiode region 15 , and a sidewall 19 of the gate electrode formed without damaging the portion of photodiode region 15 on which a surface-protecting film 8 is deposited, thereby eliminating etching damage on the surface of the substrate to be expected for a photodiode during blanket etch-back, and suppressing fixed pattern noise (FPN).
1. A method of manufacturing a CMOS image sensor, comprising the steps of:
forming a LOCOS isolation film over a surface of a semiconductor substrate containing a peripheral circuit and a photodiode region;
forming a gate electrode on a surface of the peripheral circuit;
depositing a sidewall-forming film, all over the surface of the semiconductor substrate; and
forming a sidewall of the gate electrode,
wherein the step of forming the sidewall of the gate electrode comprises the steps of:
performing blanket E/B over the sidewall-forming film in a halfway-stopping etching therein forming the surface-protecting film;
applying a photoresist over the surface-protecting film while lithographically processing the photoresist therein patterning the photoresist such that the photoresist exposes the peripheral circuit and covers at least a portion of the photodiode region; and
E/B-processing the surface-protecting film therein forming the sidewall of the gate electrode.
2. The method of manufacturing a CMOS image sensor according to claim 1 , wherein the photoresist is patterned such that the photoresist covers the LOCOS isolation film surrounding the photodiode region of the LOCOS isolation film.
3. The method of manufacturing a CMOS image sensor according to claim 1 , wherein the photoresist covers all over the photodiode region.
4. The method of manufacturing a CMOS image sensor according to claim 1 , characterized by further comprising the step of performing P + S/D implantation in the state in which the photoresist is remaining thereby forming a P + S/D implanted layer.