Oxidizing pretreatment of ONO layer for flash memory
View Patent ↗A method of forming a dielectric structure for a flash memory cell includes forming a first layer of silicon dioxide, forming a layer of silicon nitride on the first layer of silicon dioxide, and pretreating the silicon nitride layer. Pretreatment of the silicon nitride layer includes oxidation. The method further includes depositing a second layer of silicon dioxide on the pretreated silicon nitride layer. Oxidation of the silicon nitride can occur in a batch process or in a single wafer tool, such as a single wafer rapid thermal anneal (RTA) tool. The oxidizing pretreatment of the nitride layer improves the integrity of the ONO structure and enables the second layer of silicon dioxide to be deposited rather than thermally grown. Because the nitride layer undergoes less change after deposition of the second layer of silicon dioxide, the present method improves the overall reliability of the ONO structure.
1. A method of forming a dielectric structure for a flash memory cell, the method comprising:
forming a first layer of silicon dioxide;
forming a silicon nitride layer on the first layer of silicon dioxide;
oxidizing the silicon nitride layer;
depositing a second layer of silicon dioxide on the pretreated silicon nitride layer after the oxidizing; and
wherein oxidizing the silicon nitride layer occurs in a batch furnace at a temperature of approximately 800° C. to 1050° C. for approximately 5 min. to 15 ml.
2. A method of forming a dielectric structure for a flash memory cell, the method comprising:
forming a first layer of silicon dioxide;
forming a silicon nitride layer on the first layer of silicon dioxide;
oxidizing the silicon nitride layer;
depositing a second layer of silicon dioxide on the pretreated silicon nitride layer after the oxidizing; and
wherein oxidizing the silicon nitride layer occurs in a single wafer tool at a temperature of approximately 800° C. to 1100° C. for approximately 0.1 s to 6 s.
3. A method of making a flash memory cell including a first polysilicon layer, the method comprising:
forming a first layer of silicon dioxide on the first polysilicon layer;
forming a silicon nitride layer on the first layer of silicon dioxide;
oxidizing the silicon nitride layer;
depositing a second layer of silicon dioxide on the silicon nitride layer after the oxidizing; and
wherein oxidizing the silicon nitride layer occurs in a batch furnace at a temperature of approximately 800° C. to 1050° C. for approximately 5 min. to 15 min. with a gas mixture of approximately 5% oxygen to 100% oxygen and a diluent, the diluent comprising one of argon and nitrogen.
4. A method of making a flash memory cell including a first polysilicon layer, the method comprising:
forming a first layer of silicon dioxide on the first polysilicon layer;
forming a silicon nitride layer on the first layer of silicon dioxide;
oxidizing the silicon nitride layer;
depositing a second layer of silicon dioxide on the silicon nitride layer after the oxidizing; and
wherein oxidizing the silicon nitride layer occurs in a batch furnace with a temperature of approximately 800° C. to 1050° C. for approximately 5 min. to 15 min. with a gas mixture of approximately 5% steam to 100% to steam and a diluent, the diluent comprising one of argon and nitrogen.
5. A method of making a flash memory cell including a first polysilicon layer, the method comprising:
forming a first layer of silicon dioxide on the first polysilicon layer;
forming a silicon nitride layer on the first layer of silicon dioxide;
oxidizing the silicon nitride layer;
depositing a second layer of silicon dioxide on the silicon nitride layer after the oxidizing; and
wherein oxidizing the silicon nitride layer occurs in a single wafer tool at a temperature of approximately 800° C. to 1100° C. for approximately 0.1 s to 6 s with a gas mixture of approximately 5% oxygen to 100% oxygen and a diluent, the diluent comprising one of argon and nitrogen.
6. A method of making a flash memory cell including a first polysilicon layer, the method comprising:
forming a first layer of silicon dioxide on the first polysilicon layer;
forming a silicon nitride layer on the first layer of silicon dioxide;
oxidizing the silicon nitride layer;
depositing a second layer of silicon dioxide on the silicon nitride layer after the oxidizing; and
wherein oxidizing the silicon-nitride layer occurs in a single wafer tool at a temperature of approximately 800° C. to 1100° C. for approximately 0.1 s to 6 s with a gas mixture of approximately 1% steam to 10% steam and a diluent, the diluent comprising one of argon and nitrogen.