Interback-type substrate processing device
An interback-type device in which a substrate 9 is carried into the device from one side of the device and is inverted in the device to be carried out and returned to the same side, a plurality of vacuum processing chambers 21, 22, 23 are longitudinally-provided and hermetically connected, and a carry system which passes through these vacuum chambers for carrying the substrate along established carry lines 94, 95 L, 95 R is provided. The carry line includes an outward carry line 94 toward an inversion position and return carry lines 95 L, 95 R returning from the inversion position, and the outward line 94 and return carry lines 94, 95 L, 95 R are different parallel paths, and the return carry lines 95 L, 95 R are branched in plurality. The outward carry line 94 and return carry lines 95 L, 95 R are established to pass through the same three processing chambers 21, 22, 23.
1. A substrate processing device in which a substrate is carried into the device from one side of the device and is inverted in the device to be carried out and returned to the same side, the device comprising:
a plurality of vacuum processing chambers for administering a process on the substrate therein are longitudinally provided and hermetically connected to each other;
a substrate carry system which passes through the vacuum chambers, the substrate carry system includes:
a unidirectional outward carry line that extends from a first position at a first side of the device to an inversion position within the device,
a unidirectional return carry line from the inversion position to a second position at the first side of the device; and
a second unidirectional return carry line from the inversion position to the first side of the device, wherein each of the carry lines has a different path and each of the carry lines passes through a plurality of the vacuum processing chambers.
2. The substrate processing device of claim 1 , wherein the outward carry line and at least one of the return carry lines are parallel.
3. The substrate processing device of claim 1 , wherein the outward carry line or at least one of the return carry lines are branched into a plurality of parallel lines.
4. The substrate processing device of claim 1 , wherein the outward carry line and at least one of the return carry lines pass through at least one common vacuum chamber.
5. The substrate processing device of claim 4 , wherein a processing device for heating or cooling the substrate on the outward carry line or at least one of the return carry lines is provided in the common vacuum chamber.
6. The substrate processing device of claim 1 , wherein the carry line extends within a horizontal surface, the carry system comprises a substrate holder which holds the substrate upright in such a way that a plate surface thereof forms an angle of holding to the horizontal of between 45° and 90°, and the carry system further includes a horizontal movement mechanism that moves the substrate holder through the plurality of vacuum processing chambers to a perimeter vacuum chamber.
7. The substrate processing device of claim 6 , wherein the substrate holder holds two substrates simultaneously.
8. The substrate processing device of claim 7 , wherein the substrate holder holds the substrate upright in such a way that the plate surface thereof forms an angle of holding to the horizontal of between 60° and 90°.
9. The substrate processing device of claim 6 , wherein the horizontal movement mechanism comprises a longitudinal movement mechanism which affords movement of the substrate holder in the longitudinal direction which constitutes the direction of the plurality of vacuum chambers, and a lateral movement mechanism which affords movement in the lateral direction which constitutes the horizontal direction perpendicular to the longitudinal direction.
10. The substrate processing device of claim 9 , wherein the longitudinal movement mechanism carries the substrate in such a way that the plate surface of the substrate faces to the side with respect to the direction of carry.
11. A substrate processing device in which a substrate is carried into the device from one side of the device and is inverted in the device to be carried out and returned to the same side, the device comprising:
a load lock chamber for loading and unloading the substrate at the same side of the device;
a plurality of vacuum processing chambers for administering a process on the substrate therein are longitudinally provided and hermetically connected to each other;
an intermediate chamber arranged between the load lock chamber and the plurality of vacuum processing chambers;
a substrate carry system which passes through the intermediate chamber and the plurality of vacuum chambers, the substrate carry system includes:
a unidirectional outward carry line that extends from a first position at a first side of the device to an inversion position within the device,
a unidirectional return carry line from the inversion position to a second position at the first side of the device;
an intermediate line extending from the intermediate chamber to the load lock chamber;
a branch line in the intermediate chamber along which the substrate can be moved from the intermediate line to the outward carry line or from the return carry line to the intermediate line; and
a second unidirectional return carry line from the inversion position to the first side of the device, wherein each of the carry lines has a different path and each of the carry lines passes through a plurality of the vacuum processing chambers.
12. The substrate processing device of claim 11 , wherein the outward carry line and at least one of the return carry lines are parallel.
13. The substrate processing device of claim 11 , wherein the outward carry line and at least one of the return carry lines pass through at least one common vacuum chamber.
14. The substrate processing device of claim 13 , wherein a processing device for heating or cooling the substrate on the outward carry line or at least one of the return carry lines is provided in the common vacuum chamber.
15. The processing device of claim 1 , further comprising:
an inversion chamber arranged at an end of the device opposite the load lock chamber;
an inversion line in the inversion chamber along which the substrate can be moved from the inversion line to or from the outward carry line and at least one of the return carry lines.
16. A substrate processing device in which a substrate is carried into the device from one side of the device and is inverted in the device to be carried out and returned to the same side, the device comprising:
a plurality of vacuum processing chambers for administering a process on the substrate therein are longitudinally provided and hermetically connected to each other;
a substrate carry system which passes through the vacuum chambers, the substrate carry system includes:
a unidirectional outward carry line that extends from a first position at a first side of the device to an inversion position at the end of the unidirectional outward carry line within the device,
a unidirectional return carry line from the inversion position to a second position at the first side of the device; and
a second unidirectional return carry line from the inversion position to the first side of the device, wherein each of the carry lines has a different path and each of the return carry lines passes through a plurality of the vacuum processing chambers.
17. A substrate processing device in which a substrate is carried into the device from one side of the device and is inverted in the device to be carried out and returned to the same side, the device comprising:
a load lock chamber for loading and unloading the substrate at the same side of the device;
plurality of vacuum processing chambers for administering a process on the substrate therein are longitudinally provided and hermetically connected to each other;
an intermediate chamber arranged between the load lock chamber and the plurality of vacuum processing chambers;
a substrate carry system which passes through the intermediate chamber and the plurality of vacuum chambers, the substrate carry system includes:
a unidirectional outward carry line that extends from a first position at a first side of the device to an inversion position at the end of the unidirectional outward carry line within the device,
a unidirectional return carry line from the inversion position to a second position at the first side of the device;
an intermediate line extending from the intermediate chamber to the load lock chamber;
a branch line in the intermediate chamber along which the substrate can be moved from the intermediate line to the outward carry line or from the return carry line to the intermediate line; and
a second unidirectional return carry line from the inversion position to the first side of the device, wherein each of the carry lines has a different path and each of the return carry lines passes through a plurality of the vacuum processing chambers.