IP Library › Granted Patent US 6,661,102
Granted Patent Utility
US 6,661,102 · Confirmation No. 5525

SEMICONDUCTOR PACKAGING APPAATS FOR CONTROLLING DIE ATTACH FILLET HEIGHT TO REDUCE DIE SHEAR STRESS

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2026-04-08 OATH Oath or Declaration filed 10 View
2005-03-24 FRPR Certified Copy of Foreign Priority Application 17 View
2003-08-21 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-08-21 LET. Miscellaneous Incoming Letter 2 View
2003-08-05 LET. Miscellaneous Incoming Letter 3 View
2003-08-05 PGP DRAWINGS Request to accept PreGrant Publication Drawings for publication 7 View
2002-01-18 TRNA Transmittal of New Application 5 View
2002-01-18 ADS Application Data Sheet 2 View
2002-01-18 SPEC Specification 11 View
2002-01-18 CLM Claims 4 View
2002-01-18 ABST Abstract 1 View
2002-01-18 DRW Drawings-only black and white line drawings 7 View
2002-01-18 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,661,102
App. No.
10/053,994
Filed
2002-01-18
Granted
2003-12-09
Art Unit
2826
PTA
0 days