Radiation protection in integrated circuits
View Patent ↗Reduced radiation damage to an IC feature is disclosed. At least a portion of the feature which is sensitive to radiation is covered by a radiation protection layer. The radiation protection layer protects the feature from being damaged to radiation during, for example, processing of the IC. In one embodiment, the radiation protection layer comprises a noble metal, oxides, alloys, or compounds thereof.
1. An integrated circuit comprising:
a substrate;
a feature formed on the substrate;
an insulating layer formed on the feature; and
a radiation protection layer comprising a conductive material covering at least all portions of the feature which are sensitive to radiation, the radiation protection layer is electrically isolated from the feature by the insulating layer, the radiation protection layer reduces radiation damage to the portions of the feature sensitive to radiation.
2. The integrated circuit of claim 1 wherein the feature comprises a ferroelectric capacitor having top and bottom electrodes separated by a ferroelectric layer, the ferroelectric layer being sensitive to radiation.
3. The integrated circuit of claim 2 wherein the radiation protection layer is located on sidewalls of the capacitor to form spacers to reduce radiation damage to the ferroelectric layer as a result of portions of the ferroelectric layer which are unprotected by the top electrode.
4. The integrated circuit of claim 2 further comprises a plurality of features to form a memory array.
5. The integrated circuit of claim 4 wherein the radiation protection layer comprises sidewall spacers located on sidewalls of the capacitor to reduce radiation damage to the ferroelectric layer as a result of portions of the ferroelectric layer which are unprotected by the top electrode.
6. The integrated circuit of any of claims 1 - 5 wherein the material of the radiation protection layer absorbs or serves as a barrier to UV radiation.
7. The integrated circuit of claim 6 wherein the insulating layer serves as a barrier to hydrogen.
8. The integrated circuit of claim 7 wherein the material of the radiation protection layer comprises a noble metal, oxides, or compounds thereof.
9. The integrated circuit of claim 6 wherein the material of the radiation protection layer comprises a noble metal, oxides, or compounds thereof.
10. A method of fabricating an integrated circuit comprising:
providing a substrate with a feature formed on the substrate;
providing an insulating layer over the feature; and
forming a radiation protection layer comprising a conductive material to cover at least all portions of the feature which are sensitive to radiation, the insulating layer electrically isolating the conductive radiation layer from the feature, the radiation protection layer sufficiently thick to reduce radiation damage to the portions of the feature sensitive to radiation.
11. The method of claim 10 wherein the feature comprises a ferroelectric capacitor having a ferroelectric layer between top and bottom electrodes, the radiation protection layer reduces radiation damage to the ferroelectric layer as a result of portions of the ferroelectric layer which are unprotected by the top electrode.
12. The method of claim 10 wherein forming the radiation protection layer comprises forming spacers comprising the conductive material of the radiation protection layer on sidewalls of a ferroelectric capacitor to reduce radiation damage to the ferroelectric layer of the capacitor as a result of portions of the ferroelectric layer which are unprotected by the top electrode.
13. The method of claim 10 , 11 or 12 wherein the conductive material of the radiation protection layer comprises a noble metal, oxides, or compounds thereof.