Patent Application
Utility
Small
App. No. 10/094,571
· Confirmation No. 5555
APPARATUS AND METHOD FOR DEPOSITING THIN FILM ON WAFER USING ATOMIC LAYER DEPOSITION
Inventor:
Young-Hoon Park
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2002-03-07 | TRNA |
Transmittal of New Application | 4 | View | |
| 2002-03-07 | SPEC |
Specification | 18 | View | |
| 2002-03-07 | CLM |
Claims | 2 | View | |
| 2002-03-07 | ABST |
Abstract | 1 | View | |
| 2002-03-07 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2002-03-07 | OATH |
Oath or Declaration filed | 4 | View |
Inventors
Young-Hoon Park
Pyungtaek-si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Classification
USPC
438/680
C23C16/45544
C23C16/54
Y10T137/4673
C23C16/45548
C23C16/45561
C23C16/45565
C23C16/45574
Y10S438/935
Prosecution
- Examiner
- NHU, DAVID
- Art Unit
- 2818
- Customer No.
- 23413
- Docket No.
- BIP0064USD
- Confirmation No.
- 5555
Foreign Priority
00-35100
·
2000-06-24
·
REPUBLIC OF KOREA
Publication
- Pub. No.
- US20020094689A1
- Pub. Date
- 2002-07-18
Patent Term Adjustment
0days
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Quick Facts
- App. No.
- 10/094,571
- Filed
- 2002-03-07
- Granted
- 2003-06-03
- Pub. No.
- US20020094689A1
- Examiner
- NHU, DAVID
- Art Unit
- 2818
- PTA
- 0 days
External Links