IP Library Granted Patent US 6,682,958
Granted Patent Utility
US 6,682,958 · Confirmation No. 4296

METHOD FOR MANUFACTURING SEMICONDUCTOR DECICE BY USING SEALING APPARTUS

Inventor: Jiro Matsumoto
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Code Description Pages PDF
2003-12-05 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-03-25 TRNA Transmittal of New Application 2 View
2002-03-25 SPEC Specification 28 View
2002-03-25 CLM Claims 21 View
2002-03-25 ABST Abstract 1 View
2002-03-25 DRW Drawings-only black and white line drawings 14 View
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Quick Facts
Patent No.
US 6,682,958
App. No.
10/103,889
Filed
2002-03-25
Granted
2004-01-27
Pub. No.
US20020140114A1
Art Unit
2814
PTA
0 days