IP Library › Assignment 021901/0913
Patent Assignment
Reel/Frame 021901/0913

Change of Name

Recorded: 2008-11-20 Pages: 5
Assignor
OKI ELECTRIC INDUSTRY CO., LTD
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, 193-8550, JAPAN
Covered Properties (10)
Signal Compensator Circuit and Demodulator Circuit
Patent: 6,445,246 →
Application: 09/819,695 →
Publication: US 2002/0044013
Multi-Chip Package Type Semiconductor Device
Patent: 7,115,977 →
Application: 09/963,590 →
Publication: US 2002/0047213
Method for Manufacturing Semiconductor Decice by Using Sealing Appartus
Patent: 6,682,958 →
Application: 10/103,889 →
Publication: US 2002/0140114
Multi-Chip Package Type Semiconductor Device
Patent: 6,882,056 →
Application: 10/171,981 →
Publication: US 2002/0153615
Differential Voltage to Current Converter Having Transistors of Different Sizes.
Patent: 6,946,918 →
Application: 10/340,598 →
Publication: US 2003/0132805
Signal Amplitude Limiting Circuit and Filter Circuit
Patent: 6,914,455 →
Application: 10/340,599 →
Publication: US 2003/0132793
Signal Waveform Detection Circuit
Patent: 7,010,283 →
Application: 10/341,405 →
Publication: US 2003/0134608
Slot Array Antenna
Patent: 6,947,003 →
Application: 10/455,789 →
Publication: US 2004/0066346
Semiconductor Device and Method for Fabricating the Device
Patent: 7,217,631 →
Application: 11/077,212 →
Publication: US 2005/0170626
Multi-Chip Package Type Semiconductor Device
Patent: 8,053,278 →
Application: 11/540,754 →
Publication: US 2007/0048903
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 31, 2003
From: OU, HOK HUOR
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 014655/0177 →
Assignment of Assignor's Interest Jul 12, 2006
From: DENKI, MITSUBISHI; KAISHA, KABUSHIKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017927/0217 →
Assignment of Assignor's Interest Jul 12, 2006
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017927/0484 →
Assignment of Assignor's Interest Jul 17, 2006
From: DENKI, MITSUBISHI; KAISHA, KABUSHIKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017950/0065 →
Assignment of Assignor's Interest Jul 20, 2006
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017972/0602 →
Assignment of Assignor's Interest Jan 9, 2007
From: TOKUDOME, HIROYUKI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 018742/0507 →
Assignment of Assignor's Interest Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
Merger and Change of Name Nov 1, 2010
From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025238/0234 →
Change of Name Dec 5, 2011
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 027327/0143 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →