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App. No. 10/145,230 · Confirmation No. 5455

METHOD TO INCREASE THE ETCH RATE AND DEPTH IN HIGH ASPECT RATIO STRUCTURE

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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2003-09-10 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-05-13 TRNA Transmittal of New Application 1 View
2002-05-13 SPEC Specification 11 View
2002-05-13 CLM Claims 4 View
2002-05-13 ABST Abstract 1 View
2002-05-13 DRW Drawings-only black and white line drawings 4 View
2002-05-13 OATH Oath or Declaration filed 4 View
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Quick Facts
App. No.
10/145,230
Filed
2002-05-13
Granted
2004-03-23
Pub. No.
US20030211686A1
Art Unit
2813
PTA
0 days