Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
1. A modular circuit board assembly, comprising:
a substrate, having one or more components mounted thereon;
a circuit board, including a power circuit supplying power to the one or more components;
at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device for physically separably and electrically coupling the circuit board to the substrate;
wherein the substrate is communicatively coupled to a plurality of signal conductors disposed on a side of the substrate opposite the circuit board; and
wherein substantially all power supplied to the substrate is provided by the at least one conductive interconnect device.
2. The modular circuit board assembly of claim 1 , wherein each of the one or more components are a power dissipating elements, and the circuit is a power conditioning circuit.
3. The modular circuit board assembly of claim 1 , wherein:
the circuit board comprises a circuit board first conductive surface and the substrate comprises a substrate first conductive surface; and
the at least one conductive interconnect device is disposed between and in electrical contact with the circuit board first conductive surface and the substrate first conductive surface.
4. The modular circuit board assembly of claim 1 , wherein:
the circuit board comprises a circuit board first conductive surface and a circuit board second conductive surface;
the substrate comprises a substrate first conductive surface and a substrate second conductive surface; and
the at least one conductive interconnect device comprises a first portion disposed between the circuit board first conductive surface and the substrate first conductive surface, and a second portion disposed between the circuit board second conductive surface and the substrate second conductive surface.
5. The modular circuit board assembly of claim 1 , wherein the conductive interconnect device includes a first portion and a second portion.
6. The modular circuit board assembly of claim 1 , further comprising a plurality of conductive interconnect devices, wherein the plurality of conductive interconnect devices are disposed proximate the periphery of the power dissipating element and between the circuit board and the substrate.
7. The modular circuit board assembly of claim 2 , wherein each of the power dissipating elements are processors.
8. The modular circuit board assembly of claim 4 , wherein the first portion of the conductive interconnect device is disposed within the second portion of the conductive interconnect device.
9. The modular circuit board assembly of claim 5 , wherein the conductive interconnect device first portion is disposed within the conductive interconnect device second portion.
10. The modular circuit board of claim 5 , wherein the first portion provides power from the circuit to the component and the second portion grounds at least a portion of the circuit board to at least a portion of the substrate.
11. The modular circuit board of claim 7 , wherein the substrate is communicatively coupled to a plurality of pins, the pins communicatively coupleable to a computer motherboard, the plurality of pins excluding a pin providing power to the component.
12. The modular circuit board assembly of claim 8 , wherein the first portion of the conductive interconnect device is substantially coaxial with the second portion of the conductive interconnect device and of a different length than the second portion of the conductive interconnect device.
13. The modular circuit board assembly of claim 9 , wherein the conductive interconnect device first portion is disposed substantially coaxially with the conductive interconnect device second portion.
14. The modular circuit board assembly of claim 13 , further comprising a dielectric region between the conductive interconnect device first portion and the conductive interconnect device second portion.
15. The modular circuit board assembly of claim 14 , wherein the conductive interconnect device first portion and the conductive interconnect device second portion are substantially cylindrical in shape.
16. The modular circuit board assembly of claim 15 , wherein the conductive interconnect device first portion comprises a press pin.
17. The modular circuit board assembly of claim 16 , wherein the conductive interconnect device first portion comprises a hollow portion for accepting a fastening device.
18. The modular circuit board assembly of claim 16 , wherein the conductive interconnect device first portion comprises a tapered top portion.
19. The modular circuit board assembly of claim 18 , further comprising a washer disposed between the fastening device and the tapered top portion, the washer including a first tapered surface substantially mating with the tapered top portion of the conductive interconnect device first portion.
20. The modular circuit board assembly of claim 19 , wherein the washer further comprises a split section.