IP Library Assignment 040710/0662
Patent Assignment
Reel/Frame 040710/0662

Assignment of Assignor's Interest

Recorded: 2016-11-29 Pages: 11
Assignor
INCEP TECHNOLOGIES, INC.
Executed: 2004-08-23
Assignee
MOLEX INCORPORATED
2222 WELLINGTON COURT, LISLE, ILLINOIS, 60532
Covered Properties (18)
Inter-Circuit Encapsulated Packaging
Patent: 6,304,450 →
Application: 09/353,428 →
Inter-Circuit Encapsulated Packaging for Power Delivery
Patent: 6,356,448 →
Application: 09/432,878 →
Apparatus for Providing Power to a Microprocessor with Integrated Thermal and Emi Management
Patent: 6,452,113 →
Application: 09/785,892 →
Publication: US 2001/0032738
Method and Apparatus for Delivering Power to High Performance Electronic Assemblies
Patent: 6,618,268 →
Application: 09/801,437 →
Publication: US 2001/0036066
Method and Apparatus for Thermal and Mechanical Management of a Power Regulator Module and Microprocessor in Contact with a Thermally Conducting Plate
Patent: 6,452,804 →
Application: 09/802,329 →
Publication: US 2002/0057554
High Speed and Density Circular Connector for Board-to-Board Interconnection Systems
Patent: 6,609,914 →
Application: 09/921,152 →
Publication: US 2002/0016092
Vapor Chamber with Integrated Pin Array
Patent: 6,490,160 →
Application: 09/921,153 →
Publication: US 2002/0021556
Integrated Power Delivery with Flex Circuit Interconnection for High Density High Power Circuits for Integrated Circuits and Systems
Patent: 6,741,480 →
Application: 10/005,024 →
Publication: US 2002/0164895
Ultra-Low Impedance Power Interconnection System for Electronic Packages
Patent: 6,556,455 →
Application: 10/022,454 →
Publication: US 2002/0114129
Ultra-Low Impedance Power Interconnection System for Electronic Packages
Patent: 6,847,529 →
Application: 10/036,957 →
Publication: US 2003/0002268
Separable Power Delivery Connector
Patent: 6,623,279 →
Application: 10/132,586 →
Publication: US 2002/0176229
Method and Apparatus for Providing Power to a Microprocessor with Integrated Thermal and Emi Management
Patent: 6,947,293 →
Application: 10/147,138 →
Publication: US 2002/0172022
Vortex Heatsink for High Performance Thermal Applications
Patent: 6,698,511 →
Application: 10/150,730 →
Publication: US 2002/0174980
Method and Apparatus for Providing Power to a Microprocessor with Integrated Thermal and Emi Management
Patent: 7,245,507 →
Application: 10/201,384 →
Publication: US 2002/0196614
Integrated Magnetic Buck Converter with Magnetically Coupled Synchronously Rectified Mosfet Gate Drive
Patent: 6,754,086 →
Application: 10/245,908 →
Publication: US 2003/0052655
Integrated Power Delivery and Cooling System for High Power Microprocessors
Patent: 6,801,431 →
Application: 10/290,722 →
Publication: US 2003/0057548
Right-Angle Power Interconnect Electronic Packaging Assembly
Patent: 6,845,013 →
Application: 10/384,057 →
Publication: US 2003/0181075
Micro-Spring Interconnect Systems for Low Impedance High Power Applications
Patent: 7,167,379 →
Application: 10/428,202 →
Publication: US 2003/0183406
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 15, 1999
From: DIBENE II, JOSEPH TED; HARTKE, DAVID
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 010105/0737 →
Assignment of Assignor's Interest Nov 2, 1999
From: DIBENE, II JOSEPH TED; HARTKE, DAVID
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 010359/0740 →
Assignment of Assignor's Interest Jun 7, 2001
From: DIBENE II., JOSEPH T.; HARTKE, DAVID H.; DERIAN, EDWARD J.; HOGE, CARL E.
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 011864/0645 →
Assignment of Assignor's Interest Jul 18, 2001
From: DIBENE, II, JOSEPH T.; HARTKE, DAVID; KASKADE, JAMES HJERPE; HOGE, CARL E.
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 011990/0016 →
Assignment of Assignor's Interest Jul 23, 2001
From: DIBENED, II JOSEPH T.; HARTKE, DAVID H.
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 012005/0214 →
Assignment of Assignor's Interest Sep 24, 2001
From: DIBENE, JOSEPH T., II; RAISZADEH, FARHAD
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 012191/0096 →
Assignment of Assignor's Interest Sep 24, 2001
From: DIBENE, JOSEPH T., II
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 012193/0150 →
Assignment of Assignor's Interest Feb 22, 2002
From: DIBENE II, JOSEPH T.; HARTKE, DAVID H.; HOGE, CARL E.; DERIAN, EDWARD J.
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 012638/0953 →
Assignment of Assignor's Interest Apr 25, 2002
From: DERIAN, EDWARD J.; DIBENE, JOSEPH TED II; HARTKE, DAVID H.
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 012842/0257 →
Assignment of Assignor's Interest May 16, 2002
From: DIBENE, II., JOSEPH T.; HARTKE, DAVID H.
To: INCEP TECHNOLOGIES, INC
Reel/Frame 012918/0001 →
Assignment of Assignor's Interest May 17, 2002
From: DIBENE, JOSEPH T., II; RAISZADEH, FARHAD
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 012918/0079 →
Assignment of Assignor's Interest May 29, 2002
From: DIBENE, JOSEPH T., II; HARTKE, DAVID H.; HOGE, CARL E.; DERIAN, EDWARD J.
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 012934/0120 →
Assignment of Assignor's Interest Jun 17, 2002
From: HARTKE, DAVID H.; DIBENE, JOSEPH T. II
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 013013/0822 →
Assignment of Assignor's Interest Sep 17, 2002
From: HARRIS, PHILIP M.; DIBENE, JOSEPH T., II
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 013306/0195 →
Assignment of Assignor's Interest Nov 8, 2002
From: HARTKE, DAVID H.; DIBENE, JOSEPH T. II; DERIAN, EDWARD J.; BRODER, JAMES M.
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 013488/0162 →
Assignment of Assignor's Interest Apr 30, 2003
From: DIBENE II., JOSEPH T.; DERIAN, EDWARD J.
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 014039/0942 →
Assignment of Assignor's Interest Jun 18, 2003
From: HARTKE, DAVID H.; DIBENE II., J. TED
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 014179/0636 →
Change of Name Nov 29, 2016
From: MOLEX INCORPORATED
To: MOLEX, LLC
Reel/Frame 040710/0828 →