IP Library Granted Patent US 7,167,379
Granted Patent B2
US 7,167,379 · App. 10/428,202 · Granted Jan 23, 2007

Micro-spring interconnect systems for low impedance high power applications

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Quick Facts
Patent No.
US 7,167,379
App. No.
10/428,202
Granted
Jan 23, 2007
Kind
B2
Abstract

An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.

Claims (29)

1. An electronic assembly comprising:

a power conversion assembly configured to provide power and ground transmissions,

said power conversion assembly including a substrate with an aperture therein;

a compliant conductor assembly having a carrier and a plurality of spring conductors mechanically coupled to said carrier, each of said spring conductors being electronically coupled to said power conversion assembly, said plurality of spring conductors configured such that selected ones of said spring conductors are electromagnetically coupled, said carrier being mechanically coupled to said power conversion assembly and substantially surrounding said aperture; and

an electronic assembly including a microprocessor mounted on a substrate, a plurality of pads electrically coupled to said microprocessor, each of said plurality of pads being in contact with at least one of said plurality of spring conductors to thereby form an electrical path between said electronic assembly and said power conversion assembly.

2. The assembly of claim 1 wherein each of said plurality of spring conductors includes a primary beam, and a base extending from the end of said primary beam with said base being mechanically and electrically coupled to said power conversion assembly, wherein said primary beam is in electrical contact with one of said plurality of pads.

3. The assembly of claim 1 wherein each of said plurality of spring conductors includes a raised contact point.

4. The assembly of claim 1 wherein said compliant conductor assembly includes at least two linear arrays of spring conductors.

5. The assembly of claim 4 wherein said two linear arrays are generally parallel to each other.

6. The assembly of claim 5 wherein each of said plurality of spring conductors includes a secondary beam extending from a first end of said primary beam and a contact point proximate an end of said secondary beam distal from said primary beam, wherein said contact point of said secondary beam is an electrical contact with said base.

7. The assembly of claim 4 wherein said two linear arrays are generally perpendicular to each other.

8. The assembly of claim 7 wherein each of said plurality of spring conductors includes a secondary beam extending from a first end of said primary beam and a contact point proximate an end of said secondary beam distal from said primary beam, wherein said contact point of said secondary beam is an electrical contact with said base.

9. The assembly of claim 1 wherein said compliant conductor assembly includes at least four linear arrays of spring conductors, a first two of said four linear arrays being parallel to each other and another two of said four linear arrays being perpendicular to said first two of said four linear arrays.

10. The assembly of claim 6 wherein said compliant conductor assembly includes at least four linear arrays of spring conductors, a first two of said four linear arrays being parallel to each other and another two of said four linear arrays being perpendicular to said first two of said four linear arrays.

11. The assembly of claim 8 wherein said compliant conductor assembly includes at least four linear arrays of spring conductors, a first two of said four linear arrays being parallel to each other and another two of said four linear arrays being perpendicular to said first two of said four linear arrays.

12. An electronic assembly comprising:

a power conversion assembly configured to provide power and ground transmissions,

said power conversion assembly including substrate with an aperture therein;

a compliant conductor assembly having a carrier and a plurality of spring conductors mechanically coupled to said carrier, each of said spring conductors including a primary beam, and a base extending from the end of said primary beam with said base being mechanically and electrically coupled to said power conversion assembly, and wherein each of said spring conductors is electronically coupled to said power conversion assembly, said plurality of spring conductors configured such that selected ones of said spring conductors are electromagnetically coupled, said carrier being mechanically coupled to said power conversion assembly and substantially surrounding said aperture.

13. The assembly of claim 12 wherein each of said plurality of spring conductors includes a secondary beam extending from a first end of said primary beam and a contact point proximate an end of said secondary beam distal from said primary beam, wherein said contact point of said secondary beam is an electrical contact with said base.

14. The assembly of claim 12 wherein said compliant conductor assembly includes at least two linear arrays of spring conductors.

15. The assembly of claim 14 wherein said two linear arrays are generally parallel to each other.

16. The assembly of claim 15 wherein each of said plurality of spring conductors includes a secondary beam extending from a first end of said primary beam and a contact point proximate an end of said secondary beam distal from said primary beam, wherein said contact point of said secondary beam is an electrical contact with said base.

17. The assembly of claim 16 wherein said compliant conductor assembly includes at least four linear arrays of spring conductors, a first two of said four linear arrays being parallel to each other and another two of said four linear arrays being perpendicular to said first two of said four linear arrays.

18. The assembly of claim 12 wherein said two linear arrays are generally perpendicular to each other.

19. The assembly of claim 18 wherein each of said plurality of spring conductors includes a secondary beam extending from a first end of said primary beam and a contact point proximate an end of said secondary beam distal from said primary beam, wherein said contact point of said secondary beam is an electrical contact with said base.

20. The assembly of claim 19 wherein said compliant conductor assembly includes at least four linear arrays of spring conductors, a first two of said four linear arrays being parallel to each other and another two of said four linear arrays being perpendicular to said first two of said four linear arrays.

21. The assembly of claim 12 wherein said compliant conductor assembly includes at least four linear arrays of spring conductors, a first two of said four linear arrays being parallel to each other and another two of said four linear arrays being perpendicular to said first two of said four linear arrays.

22. The assembly of claim 12 wherein each of said plurality of spring conductors includes a raised contact point.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2016
From: INCEP TECHNOLOGIES, INC.
To: MOLEX INCORPORATED
Reel/Frame 040710/0662 →
CHANGE OF NAME Recorded Nov 29, 2016
From: MOLEX INCORPORATED
To: MOLEX, LLC
Reel/Frame 040710/0828 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2003
From: DIBENE II., JOSEPH T.; DERIAN, EDWARD J.
To: INCEP TECHNOLOGIES, INC.
Reel/Frame 014039/0942 →
Continuity (5)
Continuation In Part 1002245400 · Oct 30, 2001
Continuation In Part 0978589200 · Feb 16, 2001
Provisional Application 6037657800 · Apr 30, 2002
Provisional Application 6038841200 · Jun 12, 2002
Related Publication 20030183406A1 · Oct 2, 2003