IP Library Granted Patent US 7,113,430
Granted Patent B2
US 7,113,430 · App. 10/158,991 · Granted Sep 26, 2006

Device for reducing sub-threshold leakage current within a high voltage driver

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Quick Facts
Patent No.
US 7,113,430
App. No.
10/158,991
Granted
Sep 26, 2006
Kind
B2
Abstract

A device for reducing the effects of leakage current within electronic devices is disclosed. In one form, a high voltage driver includes a high voltage source coupled to at least one high voltage transistor and a leakage offset module coupled to at least a portion of one of the high voltage transistors. The leakage offset module includes a diode connected MOS device operable to generate an offset voltage and an MOS shunting device coupled in a parallel with the diode connected MOS device. During operation, the diode connected MOS device generates an offset voltage based on a sub-threshold leakage associated with using the high voltage source and the MOS shorting device is operable to short the diode connected MOS device when sub-threshold leakage current is relatively low.

Claims (34)

1. A method for reducing the effects of leakage in an electronic device comprising the steps of:

detecting a sub-threshold leakage current associated with a portion of a high voltage driver operable to output a high voltage level; and

applying an offset voltage to the portion of the high voltage driver in response to detecting the sub-threshold leakage current.

2. The method of claim 1 further comprising routing the offset voltage to a source of a transistor associated with the portion of the high voltage driver.

3. The method of claim 1 further comprising:

enabling an MOS device connected in parallel to a diode connected MOS device during periods of low relative sub-threshold current leakage; and

disabling the MOS device connected in parallel to the diode connected MOS device during periods of high relative sub-threshold current leakage, the disabling operable to initiate providing the offset voltage level.

4. The method of claim 3 further comprising coupling a leakage offset module to the high voltage driver during periods of high relative sub-threshold current leakage.

5. The method of claim 4 further comprising coupling the high voltage level to an output operably associated with a memory array, the high voltage level operable to alter a state of a portion of the memory array.

6. The method of claim 5 further comprising providing an operating mode operable to initiate erasing all of the memory array including:

disabling a low voltage selector transistor coupled to the leakage offset module;

enabling an all outputs selector transistor coupled between a ground reference and a portion of at least one of the high voltage driver; and

disabling a few outputs selector transistor coupled between the all outputs selector transistor and the leakage offset module.

7. The method of claim 5 further comprising providing an operating mode operable to initiate erasing a portion of the memory array including:

disabling a low voltage selector transistor coupled to the leakage offset module;

disabling an all outputs selector transistor coupled between a ground reference and a portion of at least one of the high voltage driver; and

enabling a few outputs selector transistor coupled between the all outputs selector transistor and the leakage offset module.

8. A device comprising

means for detecting a sub-threshold leakage current associated with a portion of a high voltage driver operable to output a high voltage level; and

means for applying an offset voltage to the portion of the high voltage driver in response to detecting the sub-threshold leakage current.

9. The device of claim 8 further comprising means for routing the offset voltage to a source of a transistor associated with the portion of the high voltage driver.

10. The device of claim 8 further comprising:

means for enabling an MOS device connected in parallel to a diode connected MOS device during periods of low relative sub-threshold current leakage; and

means for disabling the MOS device connected in parallel to the diode connected MOS device during periods of high relative sub-threshold current leakage, the disabling operable to initiate providing the offset voltage level.

11. The system of claim 8 further comprising means for coupling a leakage offset module to the high voltage driver during periods of high relative sub-threshold current leakage.

12. The devise of claim 11 further comprising means for coupling the high voltage level to an output operably associated with a memory array, the high voltage level operable to alter a state of a portion of the memory array.

13. The devise of claim 12 further comprising means for providing an operating mode operable to initiate erasing all of the memory array including:

means for disabling a low voltage selector transistor coupled to the leakage offset module;

means for enabling an all outputs selector transistor coupled between a ground reference and a portion of at least one of the high voltage driver; and

means for disabling a few outputs selector transistor coupled between the all outputs selector transistor and the leakage offset module.

14. The device of claim 12 further comprising means for providing an operating mode operable to initiate erasing a portion of the memory array including:

means for disabling a low voltage selector transistor coupled to the leakage offset module;

means for disabling an all outputs selector transistor coupled between a ground reference and a portion of at least one of the high voltage driver; and

means for enabling a few outputs selector transistor coupled between the all outputs selector transistor and the leakage offset module.

Assignments (19)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2016
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To: NORTH STAR INNOVATIONS INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2004
From: MOTOROLA, INC
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2002
From: HOEFLER, ALEXANDER; DINH, KHOI V.; JENSEN, ROBERT A.; RUTLEDGE, MATTHEW A.
To: MOTOROLA, INC.
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