Device and process for liquid treatment of wafer-shaped articles
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
1. A process for treating a wafer-shaped article with a liquid in a defined area near a peripheral edge of the wafer-shaped article, the process comprising the steps of:
placing the wafer-shaped article onto a holder, the wafer-shaped article having a first side facing the holder, a second side opposite the first side, and a peripheral edge between the first and second sides, the defined area being on the first side;
providing a gap between the first side of the wafer-shaped article and the holder, the gap extending radially inward from the peripheral edge to a recess in the holder, the radially inward extent of the gap defining the defined area;
applying the liquid in the gap to wet and treat the defined area with the liquid, the gap being filled so that the liquid simultaneously wets the defined area and part of the holder,
wherein the recess is a channel that branches from the gap at the radially inward end of the gap, and further comprising the step of diverting the liquid that has been applied in the gap to the channel.
2. The process of claim 1 , wherein a distance between the wafer-shaped article and the holder at the gap is 0.05 to 1.0 mm.
3. The process of claim 2 , wherein the distance is 0.1 to 0.5 mm.
4. The process of claim 2 , wherein the distance is constant throughout the gap.
5. The process of claim 1 , wherein the gap extends radially inward more than 2 mm from the peripheral edge of the wafer-shaped article.
6. The process of claim 1 , further comprising the step of rotating the wafer-shaped article.
7. The process of claim 6 , wherein a rotational velocity of the wafer-shaped article is at least 100/min.
8. A process for treating a wafer-shaped article with a liquid in a defined area near a peripheral edge of the wafer-shaped article, the process comprising the steps of:
placing the wafer-shaped article onto a holder, the wafer-shaped article having a first side facing the holder, a second side opposite the first side, and a peripheral edge between the first and second sides, the defined area being on the first side;
providing a gap between the first side of the wafer-shaped article and the holder, the gap extending radially inward from the peripheral edge to generally correspond to the defined area;
applying the liquid in the gap to wet and treat the defined area with the liquid, the gap being filled so that the liquid simultaneously wets the defined area and part of the holder,
wherein the step of applying the liquid comprises the step of decreasing a pressure in the gap to draw the liquid into the gap from the peripheral edge of the wafer-shaped article.
9. The process of claim 8 , wherein the step of applying the liquid comprises the steps of applying the liquid to the second side and causing the liquid to go around the peripheral edge and into the gap.
10. The process of claim 8 , wherein a distance between the wafer-shaped article and the holder at the gap is 0.05 to 1.0 mm.
11. The process of claim 10 , wherein the distance is 0.1 to 0.5 mm.
12. The process of claim 10 , wherein the distance is constant throughout the gap.
13. The process of claim 8 , wherein the gap extends radially inward more than 2 mm from the peripheral edge of the wafer-shaped article.
14. The process of claim 8 , further comprising the step of rotating the wafer-shaped article.
15. The process of claim 14 , wherein a rotational velocity of the wafer-shaped article is at least 100/min.
16. A process for treating a wafer-shaped article with a liquid in a defined area near a peripheral edge of the wafer-shaped article, the process comprising the steps of:
placing the wafer-shaped article onto a holder, the wafer-shaped article having a first side facing the holder, a second side opposite the first side, and a peripheral edge between the first and second sides, the defined area being on the first side;
providing a gap between the first side of the wafer-shaped article and the holder, the gap extending radially inward from the peripheral edge to a recess in the holder, the radially inward extent of the gap defining the defined area;
applying the liquid in the gap to wet and treat the defined area with the liquid, the gap being filled so that the liquid simultaneously wets the defined area and part of the holder,
wherein the recess is an annular gas guide at a periphery of the holder.
17. The process of claim 16 , wherein a distance between the wafer-shaped article and the holder at the gap is 0.05 to 1.0 mm.
18. The process of claim 17 , wherein the distance is 0.1 to 0.5 mm.
19. The process of claim 17 , wherein the distance is constant throughout the gap.
20. The process of claim 16 , wherein the gap extends radially inward more than 2 mm from the peripheral edge of the wafer-shaped article.
21. The process of claim 16 , further comprising the step of rotating the wafer-shaped article.
22. The process of claim 21 , wherein a rotational velocity of the wafer-shaped article is at least 100/min.
23. A process for treating a wafer-shaped article with a liquid in a defined area near a peripheral edge of the wafer-shaped article, the process comprising the steps of:
placing the wafer-shaped article onto a holder, the wafer-shaped article having a first side facing the holder, a second side opposite the first side, and a peripheral edge between the first and second sides, the defined area being on the first side;
providing a gap between the first side of the wafer-shaped article and the holder, the gap extending radially inward from the peripheral edge to generally correspond to the defined area;
applying the liquid; and
drawing the liquid into the gap by capillary forces to completely fill the gap so as to wet and treat the defined area with the liquid,
wherein the step of drawing the liquid into the gap further comprises the step of diverting all of the liquid that has been drawn into the gap to a channel that branches from the gap at the radially inward end of the gap.
24. The process of claim 23 , wherein the step of applying the liquid comprises the steps of applying the liquid onto the second surface and causing the liquid on the second surface to flow to and around the peripheral edge.
25. The process of claim 23 , wherein a distance between the wafer-shaped article and the holder at the gap is 0.05 to 1.0 mm.
26. The process of claim 25 , wherein the distance is 0.1 to 0.5 mm.
27. The process of claim 23 , wherein the distance is constant throughout the gap.
28. The process of claim 23 , wherein the gap extends radially inward more than 2 mm from the peripheral edge of the wafer-shaped article.
29. The process of claim 23 , further comprising the step of rotating the wafer-shaped article.
30. The process of claim 29 , wherein a rotational velocity of the wafer-shaped article is at least 100/min.
31. A process for treating a wafer-shaped article with a liquid in a defined area near a peripheral edge of the wafer-shaped article, the process comprising the steps of:
placing the wafer-shaped article onto a holder, the wafer-shaped article having a first side facing the holder, a second side opposite the first side, and a peripheral edge between the first and second sides, the defined area being on the first side;
providing a gap between the first side of the wafer-shaped article and the holder, the gap extending radially inward from the peripheral edge to generally correspond to the defined area;
applying the liquid;
drawing the liquid into the gap by capillary forces to completely fill the gap so as to wet and treat the defined area with the liquid; and
providing an annular gas guide at a periphery of the holder to define the gap.
32. The process of claim 31 , wherein the step of applying the liquid comprises the steps of applying the liquid onto the second surface and causing the liquid on the second surface to flow to and around the peripheral edge.
33. The process of claim 31 , wherein a distance between the wafer-shaped article and the holder at the gap is 0.05 to 1.0 mm.
34. The process of claim 33 , wherein the distance is 0.1 to 0.5 mm.
35. The process of claim 31 , wherein the distance is constant throughout the gap.
36. The process of claim 31 , wherein the gap extends radially inward more than 2 mm from the peripheral edge of the wafer-shaped article.
37. The process of claim 31 , further comprising the step of rotating the wafer-shaped article.
38. The process of claim 37 , wherein a rotational velocity of the wafer-shaped article is at least 100/min.