Granted Patent
Utility
US 6,664,184
· Confirmation No. 2257
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING AN ETCHING TREATMENT
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2003-10-17 | IFEE |
Issue Fee Payment (PTO-85B) | 2 | View | |
| 2002-06-18 | TRNA |
Transmittal of New Application | 2 | View | |
| 2002-06-18 | ADS |
Application Data Sheet | 4 | View | |
| 2002-06-18 | SPEC |
Specification | 22 | View | |
| 2002-06-18 | CLM |
Claims | 2 | View | |
| 2002-06-18 | ABST |
Abstract | 1 | View | |
| 2002-06-18 | DRW |
Drawings-only black and white line drawings | 9 | View |
Inventors
Attorneys & Agents of Record
Classification
USPC
438/650
H10P50/266
H10P50/00
H10D1/694
Prosecution
- Examiner
- TSAI, HUI JEY
- Art Unit
- 2812
- Customer No.
- 20350
- Docket No.
- 16869P-052400US
- Confirmation No.
- 2257
Foreign Priority
2001-183719
·
2001-06-18
·
JAPAN
Publication
- Pub. No.
- US20030017701A1
- Pub. Date
- 2003-01-23
Patent Term Adjustment
-3days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2018-12-31
from
HITACHI, LTD.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2012-11-21
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-09-30
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Quick Facts
- Patent No.
- US 6,664,184
- App. No.
- 10/175,471
- Filed
- 2002-06-18
- Granted
- 2003-12-16
- Pub. No.
- US20030017701A1
- Examiner
- TSAI, HUI JEY
- Art Unit
- 2812
- PTA
- -3 days
External Links