IP Library › Patent Application 10189731
Patent Application Utility Small
App. No. 10/189,731 · Confirmation No. 3811

SEMICONDUCTOR WAFERS WITH INTEGRATED HEAT SPREADING LAYER

Inventor: Stephen J. Burden
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2003-09-08 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-07-03 TRNA Transmittal of New Application 2 View
2002-07-03 SPEC Specification 9 View
2002-07-03 CLM Claims 4 View
2002-07-03 ABST Abstract 1 View
2002-07-03 DRW Drawings-only black and white line drawings 1 View
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Quick Facts
App. No.
10/189,731
Filed
2002-07-03
Granted
2003-11-25
Pub. No.
US20030010978A1
Art Unit
2815
PTA
-23 days