Patent Assignment
Reel/Frame 019974/0192
Assignment of Assignor's Interest
Recorded: 2007-10-17
Pages: 6
Assignor
ISONICS CORPORATION
Executed: 2007-09-05
Assignee
TENOROC, LLC
530 EAST CENTRAL BLVD., SUITE 1601, ORLANDO, FLORIDA, 32801
Covered Properties
(6)
Semiconductor Wafers with Integrated Heat Spreading Layer
Isotopically Pure Silicon-on-Insulator Wafers and Method of Making Same
Isotopically Enriched Luminescent Materials and Methods of Making Same
Plasma Production of Polycrystalline Silicon
Method and Apparatus for Transferring a Thin Layer of Semiconductor Material
Isotopically Pure Silicon-on-Insulator Wafers and Method of Making Same
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 23, 2002
From: BURDEN, STEPHEN J.
To: ISONICS CORPORATION
Reel/Frame 013313/0733 →
Assignment of Assignor's Interest
Sep 23, 2002
From: BURDEN, STEPHEN J.
To: ISONICS CORPORATION
Reel/Frame 013317/0748 →
Assignment of Assignor's Interest
Mar 8, 2004
From: KELSEY, PAUL V, JR.
To: ISONICS CORPORATION
Reel/Frame 015048/0138 →
Assignment of Assignor's Interest
May 6, 2004
From: BURDEN, STEPHEN J.
To: ISONICS CORPORATION
Reel/Frame 015314/0657 →
Assignment of Assignor's Interest
May 10, 2004
From: WALITZKI, HANS J.
To: ISONICS CORPORATION
Reel/Frame 015311/0475 →