IP Library › Granted Patent US 6,581,821
Granted Patent Utility Small
US 6,581,821 · Confirmation No. 1598

ELECTRONIC PACKAGE INTERCONNECT STRUCTURE COMPRISING LEAD-FREE SOLDERS

Inventor: Amit K. Sarkhel
Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2014-09-11 IMIS Miscellaneous Internal Document 1 View
2010-03-18 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2002-07-16 TRNA Transmittal of New Application 5 View
2002-07-16 A.PE Preliminary Amendment 7 View
2002-07-16 SPEC Specification 15 View
2002-07-16 CLM Claims 10 View
2002-07-16 ABST Abstract 1 View
2002-07-16 DRW Drawings-only black and white line drawings 2 View
2002-07-16 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,581,821
App. No.
10/197,291
Filed
2002-07-16
Granted
2003-06-24
Pub. No.
US20020192443A1
Art Unit
1775
PTA
0 days