IP Library Granted Patent US 6,950,952
Granted Patent B2
US 6,950,952 · App. 10/211,465 · Granted Sep 27, 2005

Dynamic power level control based on a board latch state

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Quick Facts
Patent No.
US 6,950,952
App. No.
10/211,465
Granted
Sep 27, 2005
Kind
B2
Abstract

A control circuit on a modular blade or card monitors an ejector switch. Upon detecting a latch event at the ejector switch, the control circuit signals the operating system with the appropriate power management instruction. For example, if the ejector switch on the modular blade acts as a power button, the controller will generate a power management signal in accordance with the desired power control protocol, such as ACPI.

Claims (48)

1. An apparatus comprising:

a board having a power source and a control circuit coupled to control application of power from the power source to components on the board; and

a first ejector switch electrically coupled to the control circuit to transmit a signal generated by the first ejector switch in response to a switch event, the signal to be used by the control circuit to control power management of the components of the board to signal an operating system to transition to a soft off state from the working state; and

a second ejector switch electrically coupled to the control circuit to transmit a second signal generated by the second ejector switch in response to a switch event on the second switch, wherein a switch event on the second switch signals the control circuit to signal the operating system to transition to a sleeping state from the working state.

2. The apparatus of claim 1 , wherein the first ejector switch has a first position configured to selectively lock the board into a slot and a second position that ejects the board from the slot.

3. The apparatus of claim 1 , wherein the board comprises a CompactPCl board.

4. The apparatus of claim 1 , wherein a switch event on the first ejector switch signals the control circuit to signal an operating system to transition to a sleeping state from a working state.

5. The apparatus of claim 4 , wherein a second switch event on the first ejector switch signals the control circuit to signal the operating system to transition from a sleeping state to a working state.

6. The apparatus of claim 4 , wherein the operating system is Advanced Configuration and Power Interface (ACPI) compliant.

7. The apparatus of claim 1 , wherein a second switch event on the first ejector switch signals the control circuit to signal the operating system to transition from a soft off state to the working state.

8. The apparatus of claim 1 , wherein a switch event on both the first and second switch signals the operating system to transition to a mechanical off state from a working state.

9. The apparatus of claim 1 , wherein the switch event is toggling the ejector switch from a latched position to an unlatched position.

10. The apparatus of claim 9 , wherein the signal indicates to the control circuit that the ejector switch is in an unlatched position.

11. The apparatus of claim 10 , wherein the control circuit generates a sleep signal in response to the ejector switch signal.

12. The apparatus of claim 11 , wherein the sleep signal reduces power to components on the board.

13. The apparatus of claim 10 , wherein the control circuit generates a power down request in response to the ejector switch signal.

14. The apparatus of claim 13 , wherein the power down request cuts power to at least one component on the board.

15. A system comprising:

a chassis having a plurality of slots configured to receive a blade;

a power source having a plurality of selectable power output levels; and

a blade selectively coupled to a slot and electrically coupled to the power source, the blade comprising a control circuit to request a power output level from the power source, and a first ejector switch electrically coupled to the control circuit, wherein the position of the first ejector switch is transmitted to the control circuit and used to determine a power level to be provided to one or more components of the blade and a second ejector switch electrically coupled to the control circuit to transmit a second signal generated by the second ejector switch in response to a switch event on the second switch, wherein a switch event on the second switch signals the control circuit to signal the operating system to transition a sleeping state from the working state.

16. The system in claim 15 , wherein the blade comprises a CompactPCI-compliant blade.

17. The system in claim 15 , the control circuit to request a sleeping state power output level when the ejector switch is in an unlatched position.

18. The system in claim 15 , the control circuit to request a soft off power output level when the ejector switch is in an unlatched position.

19. The system in claim 15 , the control circuit to request a mechanical off power output level when the ejector switch is in an eject position.

20. The system in claim 15 , the control circuit to request a working state power output level when the ejector switch is in a latched position.

21. A method comprising:

detecting a change from a first state to a second state for a first latch on a board to be used in a modular system;

transitioning one or more components on the board from a working state to a reduce power state in response to the change to the second state for the first latch;

detecting a change from a first state to a second state for a second latch on the board; and

transitioning one or more components on the board from the reduced power state to a mechanical off state in response to the change to the second state for the second latch.

22. The method of claim 21 further comprising:

detecting a change from the second state to the first state for the second latch; and

transitioning one or more components on the board from the mechanical of state to the reduced power state in response to the change to the first state for the second latch.

23. The method of claim 22 further comprising:

detecting a change from the second state to the first state for the first latch; and

transitioning one or more components on the board from the reduced power state to the working state in response to the change from to the first state for the first latch.

24. An article comprising a computer-readable medium having stored thereon instructions that, when executed, cause one or more processors to:

detect a change from a first state to a second state for a first latch on a board to be used in a modular system;

transition one or more components on the board from a working state to a reduce power state in response to the change to the second state for the first latch;

detect a change from a first state to a second state for a second latch on the board; and

transition one or more components on the board from the reduced power state to a mechanical off state in response to the change to the second state for the second latch.

25. The article of claim 24 further comprising instructions that, when executed, cause the one or more processors to:

detect a change from the second state to the first state for the second latch; and

transition one or more components on the board from the mechanical of state to the reduced power state in response to the change to the first state for the second latch.

26. The article of claim 25 further comprising instructions that, when executed, cause the one or more processors to:

detect a change from the second state to the first state for the first latch; and

transition one or more components on the board from the reduced power state to the working state in response to the change from to the first state for the first latch.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 4, 2013
From: INTEL CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030747/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2002
From: FELSMAN, GARY S.
To: INTEL CORPORATION
Reel/Frame 013166/0807 →