IP Library › Granted Patent US 6,582,990
Granted Patent Utility
US 6,582,990 · Confirmation No. 3273

WAFER LEVEL UNDERFILL AND INTERCONNECT PROCESS

Inventor: Martin Standing
Patented Case View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2002-08-20 TRNA Transmittal of New Application 1 View
2002-08-20 ADS Application Data Sheet 1 View
2002-08-20 SPEC Specification 7 View
2002-08-20 CLM Claims 4 View
2002-08-20 ABST Abstract 1 View
2002-08-20 DRW Drawings-only black and white line drawings 5 View
2002-08-20 OATH Oath or Declaration filed 1 View
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Quick Facts
Patent No.
US 6,582,990
App. No.
10/225,399
Filed
2002-08-20
Granted
2003-06-24
Pub. No.
US20030038342A1
Art Unit
2814
PTA
-61 days