Patent Application
Provisional
App. No. 60/314,818
· Confirmation No. 2424
Wafer level underfill and interconnect process
Inventor:
Martin Standing
Provisional Application Expired
Inventors
Martin Standing
Tonbridge, UNITED KINGDOM
Attorneys & Agents of Record
Prosecution
- Customer No.
- 2352
- Docket No.
- IR-2029 PROV
- Confirmation No.
- 2424
Child
Claims priority from a provisional application
→
App. 10/225,399
· US 6,582,990
Filed 2002-08-20
· Patented Case
Child
Claims priority from a provisional application
→
App. 10/421,971
· US 6,967,412
Filed 2003-04-22
· Patented Case
Child
PCT
Claims priority from a provisional application
→
PCT/US2002/027065
Filed 2002-08-21
· PCT - IPER (International Preliminary Examination Report) 409-416 Mailed
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/314,818
- Filed
- 2001-08-24
External Links