Particle measurement configuration and semiconductor wafer processing device with such a configuration
View Patent ↗A particle measurement configuration measures the particle concentration in a liquid or gaseous medium by way of a particle measuring instrument. In order to avoid erroneous measurements or damage to the particle measuring instrument, a measuring cell is provided which measures temperature or pressure or pH of the medium. A system controller shuts off a valve if threshold values are exceeded and it prevents the particle measuring instrument from being operated outside a predefined specification.
1. A particle measurement configuration, comprising:
a feed connection for gaseous or liquid medium;
a first measuring instrument for measuring a concentration of particles in the medium;
a second measuring instrument for measuring a parameter different from the concentration of particles in the medium;
a first valve connected in series with said feed connection, said first measuring instrument, and said second measuring instrument, said first valve being connected upstream of said first measuring instrument in a flow direction of the medium;
a control unit operatively connected to said first valve, said control unit being coupled to said second measuring instrument for receiving a signal representing the parameter, said control unit comparing said signal with a predefined threshold value and controlling a switching state of said first valve based on the comparison;
a pump having a suction connection connected downstream of said first and second measuring instruments and said first valve; and
a second valve connected downstream of said first measuring instrument.
2. The configuration according to claim 1 , wherein said second measuring instrument is configured to measure a parameter selected from the group consisting of a temperature, a pressure, and a pH of the medium.
3. The configuration according to claim 1 , wherein said control unit is coupled to said first and second valves and configured to control switching states of said valves in the same direction.
4. The configuration according to claim 1 , wherein said first and second valves are changeover valves, and further comprising a line parallel to said first measuring instrument and connected between said changeover valves.
5. The configuration according to claim 1 , wherein said control unit has an input terminal for receiving a control signal, and said control unit is configured to open said first valve based on the control signal.
6. The configuration according to claim 5 , wherein said control unit is coupled to said first measuring instrument for suppressing a measurement of the concentration of particles in the medium for a predefined time period after the first valve has been opened.
7. The configuration according to claim 1 , wherein said first and second valves are changeover valves and a third changeover valve is connected downstream of said first valve, is coupled to a connection for a flushing medium, and is coupled to said control unit, to supply a flushing agent to the series circuit via said third valve when said first valve is shut off.
8. The configuration according to claim 7 , which further comprises a fourth valve connected downstream of said second valve and coupled to said control unit, wherein, when the flushing medium is supplied into the series circuit, the flushing medium is supplied away from the series circuit via said fourth valve.
9. A device for processing semiconductor wafers, comprising a process controller for controlling a processing of the semiconductor wafers, and a particle measurement configuration according to claim 1 configured to output a signal with the first measuring instrument, and wherein said process controller controls the processing of the semiconductor wafers based on the signal representing a particle concentration in the medium.
10. The device according to claim 9 , which comprises a cleaning configuration for cleaning the semiconductor wafers with an aggressive liquid, said feed connection of the particle measurement configuration communicating with said cleaning configuration.
11. The device according to claim 10 , wherein the aggressive liquid is an acid or a base.
12. The device according to claim 9 , which comprises a high-temperature oven for the thermal growth of layers on the semiconductor wafers, and a loading station coupled to said oven, wherein said loading station encloses an inner, cleaned environment, and said feed connection is coupled to said inner environment for measuring a particle concentration in the inner environment with said first measuring instrument of the particle measurement configuration.
13. The device according to claim 12 , which comprises a vacuum-supplied handling device, wherein said feed connection is disposed on said handling device and is supplied from a further vacuum.
14. The device according to claim 12 , wherein a probe having the feed connection is disposed on a handling device for handling objects selected from the group consisting of wafer-shaped objects, flat monitors, and masks for exposing semiconductor wafers.
15. The device according to claim 12 , wherein a probe having the feed connection is disposed on a handling device for handling semiconductor wafers.