IP Library Granted Patent US 7,146,441
Granted Patent B1
US 7,146,441 · App. 10/247,114 · Granted Dec 5, 2006

SRAM bus architecture and interconnect to an FPGA

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Quick Facts
Patent No.
US 7,146,441
App. No.
10/247,114
Granted
Dec 5, 2006
Kind
B1
Abstract

An SRAM bus architecture includes pass-through interconnect conductors. Each of the pass-through interconnect conductors is connected to routing channels of the general interconnect architecture of the FPGA through an element which includes a pass transistor connected in parallel with a tri-state buffer. The pass transistors and tri-state buffers are controlled by configuration SRAM bits. Some of the pass-through interconnect conductors are connected by programmable elements to the address, data and control signal lines of the SRAM blocks, while other pass through the SRAM blocks with out being further connected to the SRAM bussing architecture.

Claims (13)

1. A bus architecture for a plurality of dedicated SRAM blocks in an FPGA comprising:

an FPGA core including a plurality of logic modules and a plurality of programmable interconnect conductors;

a first SRAM block;

a second SRAM block having a plurality of signal lines;

a first edge of said first SRAM block and a first edge of said second SRAM block wherein said first edge of said first SRAM block and said first edge of said second SRAM block are adjacent to said FPGA core;

a second edge of said first SRAM block and a second edge of said second SRAM block wherein said second edge of said first SRAM block are adjacent to said second edge of said second SRAM block;

a plurality of pass-through interconnect conductors spanning said first and second SRAM blocks and perpendicular to said first edge of said first SRAM block and said first edge of said second SRAM block;

a plurality of SRAM signal lines of said first SRAM block and a plurality of SRAM signal lines of said second SRAM block traversing each of said first and second SRAM blocks perpendicular to and forming intersections with said plurality of pass-through interconnect conductors;

a first plurality of user-programmable connectors connecting at least one of said programmable interconnect conductors of said FPGA core at least one of said pass-through interconnect conductors;

a second plurality of user-programmable connectors connecting at least one of said plurality of SRAM signal lines of said first SRAM block to at least one of said SRAM signal lines of said second SRAM block; and

a third plurality of user-programmable connectors connecting at least one of said pass-through interconnect conductors to at least one of said plurality of SRAM signal lines of said first SRAM block and said plurality of SRAM signal lines of said second SRAM block.

2. A bus architecture as in claim 1 , wherein said user-programmable connectors comprise a tri-statable buffer disposed in parallel with a pass transistor.

3. A bus architecture as in claim 1 , wherein said user-programmable connectors comprise a MOS pass-transistor.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →