Multi-layer film packaging of hot melt adhesive
View Patent ↗Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.
1. A packaged hot melt adhesive comprising a hot melt adhesive encased in a thermoplastic film, said film being a multi-layer film comprising at least two thermoplastic layers which have different melting points, wherein one layer of said at least two layers comprises more than 50% of the film.
2. The packaged hot melt adhesive of claim 1 wherein said one layer of said multi-layer film has a melting point of below 100° C. and at least one other layer has a melting point above 100° C.
3. The packaged hot melt adhesive of claim 2 wherein the multi-layer film comprises two layers.
4. The packaged hot melt adhesive of claim 2 wherein the multi-layer film comprises three layers.
5. The packaged hot melt adhesive of claim 2 wherein said one layer has a melting point of below about 90° C.
6. The packaged hot melt adhesive of claim 2 wherein said one layer comprises from about 65% to about 85% of the film.
7. The packaged hot melt adhesive of claim 2 wherein at least one layer of said multi-layer film comprises a copolymer of ethylene or propylene with another comonomer.
8. The packaged hot melt adhesive of claim 7 wherein at least one layer of said multi-layer film comprises a copolymer of ethylene with from about 10% to about 45% methyl acrylate, n-butyl acrylate or vinyl acetate comonomers.
9. The packaged hot melt adhesive of claim 2 wherein said one layer of said multi-layer film comprises ethylene methyl acrylate.
10. The packaged hot melt adhesive of claim 9 wherein said at least one other layer of said multi-layered film comprises ethylene vinyl acetate.
11. The packaged hot melt adhesive of claim 2 wherein the hot melt adhesive is a low application temperature hot melt adhesive.
12. A method of packaging a low temperature hot melt adhesive comprising wrapping a low temperature hot melt adhesive in a thermoplastic film, said film being a multi-layer thermoplastic film comprising at least two thermoplastic layers which have different melting points, wherein one layer of said at least two layers comprises more than 50% of the film.
13. The method of claim 12 wherein said one layer of said multi-layer film has a melting point below 100° C. and said at least one other layer of said multilayer film has a melting point above 100° C.
14. The method of claim 13 wherein the adhesive is wrapped in the molten state.
15. The method of claim 14 wherein the molten hot melt adhesive is pumped or poured into a cylindrical tube of plastic film, said film being a multilayer film comprising at least two layers that have different melting points and where one layer comprises more than 50% of the film and has a melting point below 100° C., and at least one other layer has a melting point above 100° C., the cylindrical tube being in direct contact with a heat sink, sealing the adhesive filled cylinder and allowing the filled cylinder to cool.
16. The method of claim 15 wherein at least one layer of said multilayer film comprises a copolymer of ethylene or propylene with another comonomer.
17. The method of claim 15 wherein said one layer of said multi-layer film has a melting point of below 90° C.
18. The method of claim 16 wherein at least one layer of said multilayer film comprises a copolymer of ethylene with from about 10% to about 45% methyl acrylate, n-butyl acrylate or vinyl acetate comonomers.
19. The method of claim 18 wherein said one layer of said multi-layer film comprises ethylene methyl acrylate.
20. The method of claim 18 wherein said at least one other layer of said multi-layer film comprises ethylene vinyl acetate comonomer.