IP Library › Assignment 021912/0634
Patent Assignment
Reel/Frame 021912/0634

Assignment of Assignor's Interest

Recorded: 2008-11-19 Pages: 105
Assignors
INDOPCO, INC.
Executed: 2008-04-01
Assignee
HENKEL KGAA
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Properties (209)
Conductive Materials with Electrical Stability and Good Impact Resistance for Use in Electronics Drive
Adhesive for Bag Sealing Application
Multi-Layer Adhesive Film for Die Stacking
Radiation-Or Thermally-Curable Barrier Sealants
Radiation-Curable Rubber Adhesive/Sealant
Thermally Curable Epoxy-Amine Barrier Sealants
Acrylic Hot Melt Adhesives
Acrylic Polymer-Based Adhesives
Acrylic Polymer-Based Adhesives
Board on Chip Package and Process for Making Same
Process for Coating a Bumped Semiconductor Wafer
Semiconductor Wafter Coated with a Filled, Spin-Coatable Material
Maleimide Containing Ester and Sulfide Functionalities
Thermally Conductive Composition
Antistatic Protective Hot Melt Adhesives
Acrylic Hot Melt Adhesives
Composition Containing Porphyrin to Improve Adhesion
1,3-Dipolar Cycloaddition of Azides to Alkynes
Alcohols Containing Imide Moieties and Reactive Oligomers Prepared Therefrom
Lubricant for Hot Forging Applications
Electrically Conductive Composition
Composition with Thermally-Treated Silica Filler for Performance Enhancement
Waterborne Conductive Compositions
Method of Containing Resin Bleed
Redox-Induced Cationically Polymerizable Compositions with Low Cure Temperature
Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same
Curable Resins Containing Acetal, Ketal, Acetal Ester, or Ketal Ester Linkages
Compounds Having a Diphenyl Oxide Backbone and Maleimide Functional Group
Reactive Hot Melt Adhesive with Bituminous Additive
Organic Electronic Devices Protected by Elastomeric Laminating Adhesive
Curable Compositions Prepared from Multifunctional and Hybrid N-Vinylformamide Compounds
Corrugating Adhesive and Use Thereof
Die Attach Adhesives for Use in Microelectronic Devices
Patent: 6,265,530 →
Application: 09/336,245 →
Bioadhesive Composition
Patent: 6,824,792 →
Application: 09/907,413 →
Publication: US 2002/0028241
Foamed adhesive and use thereof
Application: 09/916,779 →
Publication: US 2003/0026976
Curable Electron Donor Compounds
Patent: 6,908,957 →
Application: 09/922,187 →
Publication: US 2002/0010281
Die Attach Adhesives with Vinyl Ether and Carbamate or Urea Functionality
Patent: 6,699,929 →
Application: 09/927,242 →
Publication: US 2002/0032257
Tackified Acrylic Pressure Sensitive Adhesive
Patent: 6,805,954 →
Application: 09/941,162 →
Publication: US 2003/0082373
Compounds Containing Vinyl Silane and Electron Donor or Acceptor Functionality
Patent: 6,570,032 →
Application: 09/966,448 →
Epoxy Compounds Containing Styrenic or Cinnamyl Functionality
Patent: 6,441,121 →
Application: 09/966,449 →
Adhesion Promoters Containing Benzotriazoles
Patent: 6,930,136 →
Application: 09/966,453 →
Publication: US 2003/0098440
Vinyl Silane Compounds Containing Epoxy Functionality
Patent: 6,590,018 →
Application: 09/966,454 →
Publication: US 2003/0083452
Water-based bottle labeling adhesive
Application: 09/969,893 →
Publication: US 2003/0064178
Fluid Resistant Silicone Encapsulant
Patent: 6,841,647 →
Application: 09/993,589 →
Publication: US 2003/0187153
Bookbinding Process
Patent: 8,333,542 →
Application: 10/000,763 →
Publication: US 2003/0077148
Adhesive and Use Thereof
Patent: 6,749,705 →
Application: 10/002,459 →
Publication: US 2003/0091811
Dual Cure B-Stageable Underfill for Wafer Level
Patent: 6,833,629 →
Application: 10/020,638 →
Publication: US 2003/0141592
Novel Reagents for Heat Activated Polymer Crosslinking
Patent: 7,285,600 →
Application: 10/026,017 →
Publication: US 2002/0115888
Adhesive Wafers for Die Attach Application
Patent: 6,620,651 →
Application: 10/040,674 →
Publication: US 2003/0087479
Adhesive for difficult to bond substrates
Application: 10/053,497 →
Publication: US 2003/0091760
Bioadhesive Composition
Patent: 7,846,478 →
Application: 10/061,622 →
Publication: US 2003/0143277
No-Flow Underfill Encapsulant
Patent: 6,624,216 →
Application: 10/062,906 →
Publication: US 2003/0149135
Curable Compositions Containing Benzoxazine
Patent: 6,620,905 →
Application: 10/080,738 →
Underfill Encapsulant for Wafer Packaging and Method for Its Application
Patent: 7,037,399 →
Application: 10/084,869 →
Publication: US 2003/0171456
Film Containing Starch
Application: 10/100,260 →
Publication: US 2003/0099692
Electron Donors, Electron Acceptors and Adhesion Promoters Containing Disulfide
Patent: 6,803,406 →
Application: 10/113,059 →
Publication: US 2003/0191270
Water Based Adhesive Composition with Release Properties
Patent: 6,838,187 →
Application: 10/143,332 →
Publication: US 2003/0211351
Curable Compositions Containing Thiazole Functionality
Patent: 6,706,835 →
Application: 10/200,481 →
Publication: US 2004/0014903
Cycloaliphatic Epoxy Compounds Containing Styrenic, Cinnamyl, or Maleimide Functionality
Patent: 6,716,992 →
Application: 10/201,373 →
Publication: US 2004/0014890
Remoistenable Pre-Applied Adhesive
Patent: 7,235,608 →
Application: 10/205,137 →
Publication: US 2004/0018332
Two Part Epoxide Adhesive with Improved Strength
Patent: 6,645,341 →
Application: 10/213,883 →
Hot melt adhesive and use thereof
Application: 10/236,270 →
Publication: US 2004/0045666
Reactive Hot Melt Adhesive with Non-Polymeric Aromatic Difunctionals
Patent: 7,037,402 →
Application: 10/271,677 →
Publication: US 2004/0072952
Low Application Temperature Hot Melt Adhesive
Patent: 7,795,336 →
Application: 10/273,836 →
Publication: US 2004/0077240
Curable Compounds Containing Reactive Groups: Triazine/Isocyanurates, Cyanate Esters and Blocked Isocyanates
Patent: 7,057,264 →
Application: 10/274,664 →
Publication: US 2004/0075161
Multi-Layer Film Packaging of Hot Melt Adhesive
Patent: 7,350,644 →
Application: 10/274,827 →
Publication: US 2004/0074800
Moisture Cured Reactive Hot Melt Adhesive with Monofunctional Reactants as Grafting Agents
Patent: 7,112,631 →
Application: 10/280,298 →
Publication: US 2004/0079482
Toughened Epoxy-Anhydride No-Flow Underfill Encapsulant
Patent: 7,056,978 →
Application: 10/289,504 →
Publication: US 2004/0087681
Semiconductor Package with a Die Attach Adhesive Having Silane Functionality
Patent: 6,784,025 →
Application: 10/301,924 →
Publication: US 2004/0097014
Unsaturated Compounds Containing Silane, Electron Donor and Electron Acceptor Functionality
Patent: 6,809,155 →
Application: 10/302,574 →
Publication: US 2004/0097651
Adhesive with Carboxyl Benzotriazole for Improved Adhesion to Metal Substrates
Patent: 6,822,047 →
Application: 10/336,067 →
Publication: US 2004/0132955
Method for the Preparation of a Stable Anaerobic//Uv/Visible Light Curable Adhesive
Patent: 6,664,357 →
Application: 10/348,654 →
Envelope Quality Control Apparatus
Patent: 6,802,214 →
Application: 10/364,795 →
Publication: US 2004/0154415
Hot Melt Adhesive Composition
Patent: 6,794,443 →
Application: 10/367,543 →
Publication: US 2004/0162396
Conductive Materials with Electrical Stability and Good Impact Resistance for Use in Electronics Devices
Patent: 7,108,806 →
Application: 10/377,988 →
Publication: US 2004/0169162
Electronic Device Containing Thermal Interface Material
Patent: 6,776,226 →
Application: 10/388,031 →
Reactive Hot Melt Adhesive with Improved Hydrolysis Resistance
Patent: 8,664,330 →
Application: 10/408,141 →
Publication: US 2004/0198899
Process for Making Pressure Sensitive Adhesive Tapes from Cationic Cure Adhesives
Patent: 7,700,151 →
Application: 10/412,840 →
Publication: US 2004/0202811
Labeling Adhesive
Patent: 7,109,263 →
Application: 10/428,890 →
Publication: US 2004/0220308
Oxetane Compounds Containing Maleimide Functionality
Patent: 6,982,338 →
Application: 10/430,085 →
Publication: US 2004/0225070
Oxetane Compounds Containing Styrenic Functionality
Patent: 6,953,862 →
Application: 10/430,086 →
Publication: US 2004/0225071
A Method of Attaching a Die to a Substrate Using a Hybrid Oxetane Compound
Patent: 7,034,064 →
Application: 10/430,089 →
Publication: US 2004/0225074
Oxetane Compounds Containing Cinnamyl Functionality
Patent: 6,753,434 →
Application: 10/430,114 →
Method of Using Pre-Applied Underfill Encapsulant
Patent: 7,047,633 →
Application: 10/444,398 →
Publication: US 2004/0234689
Pre-Applied Fluxing Underfill Composition Having Pressure Sensitive Adhesive Properties
Patent: 7,004,375 →
Application: 10/444,604 →
Publication: US 2004/0232210
Method for Pre-Applied Thermoplastic Reinforcement of Electronic Components
Patent: 6,978,540 →
Application: 10/444,867 →
Publication: US 2004/0231152
Novel Reactive Hot Melt Adhesives
Patent: 7,829,615 →
Application: 10/457,260 →
Publication: US 2004/0249076
Foamed adhesive and applications thereof
Application: 10/462,183 →
Publication: US 2004/0250516
Polymeric Photoinitiators
Patent: 7,157,535 →
Application: 10/465,473 →
Publication: US 2003/0236425
Maleimide Resin with Cyanurate Core
Patent: 7,456,280 →
Application: 10/549,899 →
Publication: US 2007/0232802
Assembly of a Semiconductor Die Attached to Substrate with Oxazoline Derivative Bearing an Electron Donor or Acceptor Functionality
Patent: 7,528,404 →
Application: 10/555,291 →
Publication: US 2006/0263928
Low Application Temperature Elastic Attachment Adhesive
Patent: 7,799,863 →
Application: 10/587,374 →
Publication: US 2007/0161742
Hot melt adhesive
Application: 10/613,409 →
Publication: US 2005/0003197
Thermal Interface Material
Patent: 6,874,573 →
Application: 10/632,330 →
Publication: US 2005/0022971
Hot melt adhesive containing a neutralizing additive
Application: 10/635,139 →
Publication: US 2005/0032963
Hot Melt Adhesive
Patent: 7,208,541 →
Application: 10/646,417 →
Publication: US 2005/0042469
Hot Melt Adhesive Composition
Patent: 7,166,662 →
Application: 10/680,276 →
Publication: US 2005/0075431
Sprayable Adhesive Material for Laser Marking Semiconductor Wafers and Dies
Patent: 7,186,945 →
Application: 10/685,818 →
Publication: US 2005/0082338
Sulfonium Salt Photinitiators and Use Thereof
Patent: 7,230,122 →
Application: 10/700,754 →
Publication: US 2005/0095528
Uv Curable Protective Encapsulant
Patent: 7,479,653 →
Application: 10/727,951 →
Publication: US 2005/0121665
Corrugating Method and Means
Patent: 6,827,784 →
Application: 10/748,908 →
Polymer Compounds Containing Oxetane and Cinnamyl Functionality
Patent: 6,943,258 →
Application: 10/752,408 →
Publication: US 2004/0225081
Fluid Resistant Silicone Encapsulant
Patent: 7,199,206 →
Application: 10/753,293 →
Publication: US 2004/0192874
Pre-applied thermoplastic reinforcement for electronic components
Application: 10/768,868 →
Publication: US 2004/0238925
Pre-applied thermoplastic reinforcement for electronic components
Application: 10/768,910 →
Publication: US 2004/0245611
Ionomer-Containing Hot Melt Adhesive
Patent: 7,795,341 →
Application: 10/773,547 →
Publication: US 2005/0176868
Adhesive Containing Radial Block Copolymer
Patent: 7,655,720 →
Application: 10/779,420 →
Publication: US 2005/0182183
Adhesive containing radial block copolymer
Application: 10/779,492 →
Publication: US 2005/0182194
Elastic attachment adhesive containing radial block copolymer
Patent: 8,465,844 →
Application: 10/779,505 →
Publication: US 2005/0181207
Waterbased High Abrasion Resistant Coating
Patent: 7,247,673 →
Application: 10/783,315 →
Publication: US 2005/0192391
Hot melt adhesive composition
Application: 10/786,185 →
Publication: US 2004/0167258
Ultraviolet-curable waterborne coating
Application: 10/812,134 →
Publication: US 2005/0215654
Dicing die bonding film
Application: 10/815,420 →
Publication: US 2005/0227064
Method to Improve High Temperature Cohesive Strength with Adhesive Having Multi-Phase System
Patent: 7,160,946 →
Application: 10/815,442 →
Publication: US 2005/0222330
Reactive Hot Melt Adhesive with Improved Properties
Patent: 7,138,466 →
Application: 10/818,673 →
Publication: US 2005/0222362
Unsaturated Compounds Containing Silane, Electron Donor and Electron Acceptor Functionality
Patent: 6,908,969 →
Application: 10/841,059 →
Publication: US 2004/0242796
Hot Melt Adhesive
Patent: 7,148,284 →
Application: 10/851,584 →
Publication: US 2005/0261416
Adhesive for bag sealing application
Application: 10/853,750 →
Publication: US 2005/0276938
Compositions Containing Oxetane Compounds for Use in Semiconductor Packaging
Patent: 7,230,055 →
Application: 10/901,631 →
Publication: US 2006/0025542
Fluid Resistant Silicone Encapsulant
Patent: 7,273,916 →
Application: 10/901,699 →
Publication: US 2005/0003217
Fluid Resistant Silicone Encapsulant
Patent: 7,241,852 →
Application: 10/901,713 →
Publication: US 2004/0266945
Sulfonium salt photoinitiators and use thereof
Application: 10/918,946 →
Publication: US 2005/0095531
Fire Retardant Foam and Gel Compositions
Patent: 7,033,526 →
Application: 10/932,454 →
Publication: US 2005/0127338
Curable Electron Donor Compositions
Patent: 7,326,746 →
Application: 10/967,493 →
Publication: US 2007/0060683
Reactive hot melt adhesive with block acrylic copolymer
Application: 10/968,658 →
Publication: US 2006/0084755
Method of using pre-applied underfill encapsulant
Application: 10/969,588 →
Publication: US 2005/0074547
Low temperature snap cure material with suitable worklife
Application: 10/997,350 →
Publication: US 2006/0111496
Triacetin resistant hot melt adhesive
Application: 11/023,052 →
Publication: US 2006/0137700
Photoinitiators and Uv-Crosslinkable Acrylic Polymers for Pressure Sensitive Adhesives
Patent: 7,745,505 →
Application: 11/024,570 →
Publication: US 2006/0142408
Transdermal Drug Delivery Device Comprising an Acrylic Block Copolymer-Based Adhesive
Patent: 7,384,998 →
Application: 11/043,474 →
Publication: US 2005/0228135
Solution pressure sensitive adhesives based on acrylic block copolymers
Application: 11/047,924 →
Publication: US 2006/0173124
Package or pre-applied foamable underfill for lead-free process
Application: 11/054,164 →
Publication: US 2006/0177966
Low Stress Conductive Adhesive
Patent: 7,326,369 →
Application: 11/073,778 →
Publication: US 2006/0197066
Radiation curable cycloaliphatic barrier sealants
Application: 11/098,115 →
Publication: US 2006/0223937
Cationically curable oxetane and cationic initiator
Application: 11/098,116 →
Publication: US 2006/0223978
Radiation-Curable Desiccant-Filled Adhesive/Sealant
Patent: 7,687,119 →
Application: 11/098,117 →
Publication: US 2006/0223903
Polymer Compounds Containing Oxetane and Styrenic Functionality
Patent: 7,452,943 →
Application: 11/120,585 →
Publication: US 2005/0192446
Polymer Compounds Containing Oxetane and Maleimide Functionality
Patent: 7,319,132 →
Application: 11/121,430 →
Publication: US 2005/0209437
Weatherstrip coating
Application: 11/146,267 →
Publication: US 2006/0276599
System for dispensing viscous liquids
Application: 11/152,430 →
Publication: US 2005/0274740
Metal salts of maleimide compounds as conductivity promoters
Application: 11/157,611 →
Publication: US 2006/0284141
Semiconductor assembly using dual-cure die attach adhesive
Application: 11/168,037 →
Publication: US 2005/0238881
Process for Exposing Solder Bumps on an Underfill Coated Semiconductor
Patent: 7,338,842 →
Application: 11/168,236 →
Publication: US 2007/0020815
Thermal interface material
Application: 11/178,138 →
Publication: US 2005/0250910
Activatable compositions
Application: 11/181,381 →
Publication: US 2007/0014985
Use of foamed adhesives to make paper cores or tubes
Application: 11/199,324 →
Publication: US 2005/0271839
Quinolinols as Fluxing and Accelerating Agents for Underfill Compositions
Patent: 7,378,523 →
Application: 11/211,406 →
Publication: US 2007/0049722
Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives
Application: 11/211,920 →
Publication: US 2007/0049665
Mucosal delivery tablet
Application: 11/212,437 →
Publication: US 2007/0048369
Metal Salts of Quinolinols and Quinolinol Derivatives in Curable Compositions
Patent: 7,468,407 →
Application: 11/235,991 →
Publication: US 2007/0072966
Acrylic pressure sensitive adhesives
Application: 11/238,277 →
Publication: US 2007/0071800
Foamed adhesive for casing-in
Application: 11/244,799 →
Publication: US 2007/0081875
Integrated Low Application Temperature Hot Melt Adhesive Processing System
Patent: 8,225,963 →
Application: 11/244,808 →
Publication: US 2007/0080157
Thermoset Adhesive Films
Patent: 7,326,754 →
Application: 11/248,490 →
Publication: US 2006/0030672
Rfid Antenna with Pre-Applied Adhesives
Patent: 7,456,748 →
Application: 11/255,117 →
Publication: US 2007/0089286
Boron Nitride Based Lubricant Additive
Application: 11/275,506 →
Publication: US 2007/0161518
Thermally conductive acrylic polymer composition
Application: 11/275,786 →
Publication: US 2007/0179232
Hot melt adhesives for medical application
Application: 11/282,510 →
Publication: US 2006/0110596
Adhesive containing block copolymers
Application: 11/284,102 →
Publication: US 2007/0117934
B-Stageable Underfill Encapsulant and Method for Its Application
Patent: 7,608,487 →
Application: 11/284,219 →
Publication: US 2006/0125119
Adhesive Composition
Patent: 7,868,094 →
Application: 11/284,241 →
Publication: US 2007/0117927
Method of preparing filters
Application: 11/291,367 →
Publication: US 2006/0117728
Foamable underfill encapsulant
Application: 11/333,940 →
Publication: US 2006/0142424
Underfill encapsulant for wafer packaging and method for its application
Application: 11/351,647 →
Publication: US 2006/0194064
Peelable Hot Melt Adhesive
Patent: 7,470,740 →
Application: 11/364,301 →
Publication: US 2006/0241235
Curable Materials Containing Siloxane
Application: 11/369,429 →
Publication: US 2007/0212556
Reactive hot melt adhesive with non-polymeric aliphatic difunctionals
Application: 11/372,785 →
Publication: US 2006/0210808
Adhesive of Solid Epoxy, Latent Hardener, Thixotropic Agent and Solvent
Application: 11/373,437 →
Publication: US 2007/0212551
Anisotropic conductive adhesive
Application: 11/373,484 →
Publication: US 2007/0213429
Method for reducing freeze-thaw voids in uncured adhesives
Application: 11/402,170 →
Publication: US 2006/0210748
Hot melt adhesive for packaging applications
Application: 11/409,136 →
Publication: US 2007/0249771
Use of Debranched Starch in Extrusion-Spheronization Pharmaceutical Pellets
Patent: 8,318,230 →
Application: 11/410,375 →
Publication: US 2006/0246192
System for concealing joints
Application: 11/414,992 →
Publication: US 2007/0254151
Compositon useful for delivery of active agents
Application: 11/418,289 →
Publication: US 2006/0251585
Absorbent Articles Comprising a Radiation Cured Hot Melt Positioning Adhesive
Patent: 7,754,327 →
Application: 11/432,007 →
Publication: US 2007/0264497
Two Component Polyurethane Adhesive
Patent: 7,834,123 →
Application: 11/437,926 →
Publication: US 2007/0270567
Low viscosity curable compositions
Application: 11/450,486 →
Publication: US 2007/0287775
Radiation curable cycloaliphatic barrier sealants
Application: 11/474,772 →
Publication: US 2007/0117917
Optoelectronic Device Sealed With Sealant of Oxetane Compound and Cationic Initiator
Application: 11/502,707 →
Publication: US 2007/0034515
Thermally conductive material
Application: 11/502,708 →
Publication: US 2008/0039555
Siloxane Resins with Oxetane Functionality
Patent: 7,414,103 →
Application: 11/505,083 →
Publication: US 2007/0037951
Moisture cured reactive hot melt adhesive with monofunctional reactants as grafting agents
Patent: 8,933,176 →
Application: 11/514,499 →
Publication: US 2007/0027272
Dicing die bonding film
Application: 11/514,556 →
Publication: US 2007/0003758
Acrylic polymer-based adhesives
Application: 11/526,131 →
Publication: US 2007/0072986
Acrylic polymer-based adhesives
Application: 11/526,135 →
Publication: US 2007/0072987
Metal salts of quinolinols and quinolinol derivatives as corrosion inhibitors
Application: 11/545,238 →
Publication: US 2007/0072968
Lubricant for Hot Forging Applications
Patent: 8,283,296 →
Application: 11/545,883 →
Publication: US 2008/0090740
Waterbased low noise generating coating
Application: 11/546,890 →
Publication: US 2008/0090948
Polymeric Photoinitiators
Patent: 7,795,364 →
Application: 11/606,685 →
Publication: US 2007/0208099
Polymeric Photoinitiators
Patent: 7,799,884 →
Application: 11/606,686 →
Publication: US 2007/0078246
Process to generate water based adhesives and their use
Application: 11/630,853 →
Publication: US 2010/0027370
Waterborne Adhesive
Patent: 7,871,488 →
Application: 11/640,734 →
Publication: US 2008/0146710
Product and Method for Concealing Joints
Patent: 7,841,146 →
Application: 11/651,435 →
Publication: US 2008/0163584
Reactive Hot Melt Adhesive with Bituminous Additive
Patent: 7,625,963 →
Application: 11/657,859 →
Publication: US 2008/0182925
Conductive Materials
Patent: 7,722,786 →
Application: 11/678,140 →
Publication: US 2008/0202380
Low Application Temperature Hot Melt Adhesive
Patent: 7,683,114 →
Application: 11/716,954 →
Publication: US 2007/0173153
Electrically Conductive Uv-Curable Ink
Patent: 7,569,160 →
Application: 11/733,279 →
Publication: US 2008/0250972
Compositions for Use in Electronics Devices
Application: 11/734,988 →
Publication: US 2008/0054227
Corrosion-Preventive Adhesive Compositions
Application: 11/752,591 →
Publication: US 2008/0292801
Sulfonium Salt Photoinitiators and Use Thereof
Patent: 7,560,219 →
Application: 11/789,873 →
Publication: US 2007/0203254
Method of Fluxing Using Fluxing Compositions Containing Benzotriazoles
Application: 11/828,640 →
Publication: US 2007/0277907
Reactive Hot Melt Adhesive
Patent: 9,212,300 →
Application: 11/837,152 →
Publication: US 2009/0042040
UV Curable Coating Composition
Patent: 8,796,348 →
Application: 11/861,486 →
Publication: US 2009/0082485
Highly Conductive Composition for Wafer Coating
Application: 11/941,498 →
Publication: US 2008/0166543
Moisture Curable Hot Melt Adhesive
Application: 11/961,345 →
Publication: US 2009/0159206
Insulation and Method of Installing
Application: 11/964,268 →
Publication: US 2009/0165942
Hot Melt Adhesive
Patent: 8,076,407 →
Application: 12/028,424 →
Publication: US 2009/0203847
Corrosion-Resistant Anisotropic Conductive Compositions
Application: 60/912,223 →
Thermally-Conductive Compositions
Application: 60/912,236 →
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Dec 3, 2008
From: HENKEL KGAA
To: HENKEL AG & CO. KGAA
Reel/Frame 022309/0718 →
Assignment of Assignor's Interest Jul 19, 2010
From: MUSA, OSAMA M.; HERR, DONALD E.
To: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
Reel/Frame 024705/0079 →
Assignment of Assignor's Interest Aug 29, 2016
From: FOREMAN, PAUL B.; RICHARDSON, PAUL; TSAI, JOHN; REMON, JEAN PAUL
To: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
Reel/Frame 039562/0830 →
Assignment of Assignor's Interest Aug 29, 2016
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
To: REMON, JEAN PAUL; VOORSPOELS, JODY; AMEYE, DIETER; CALLENS, CATHERINE
Reel/Frame 039562/0930 →
Assignment of Assignor's Interest Aug 29, 2016
From: REMON, JEAN PAUL; VOORSPOELS, JODY; AMEYE, DIETER; CALLENS, CATHERINE
To: UNIVERSITEIT GENT
Reel/Frame 039562/0987 →