IP Library › Granted Patent US 7,528,404
Granted Patent B2
US 7,528,404 · App. 10/555,291 · Granted May 5, 2009

Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality

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Quick Facts
Patent No.
US 7,528,404
App. No.
10/555,291
Granted
May 5, 2009
Kind
B2
Abstract

An assembly of a semiconductor die attached to a substrate is made with a composition comprising compounds that contain an oxazoline functionality and an electron acceptor or an electron donor functionality. Electron donor functionalities include styrenic, cinnamyl, and vinyl ether groups. Electron acceptor functionalities include maleimide, acrylate, fumarate, and maleate groups. An exemplary compound has the structure: formula (I).

Claims (2)

1. An assembly of a semiconductor die attached to a substrate with a composition consisting essentially of a compound having the structure,

a curing agent and a filler.

Assignments (3)
CHANGE OF NAME Recorded Dec 3, 2008
From: HENKEL KGAA
To: HENKEL AG & CO. KGAA
Reel/Frame 022309/0718 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2008
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION; INDOPCO, INC.
To: HENKEL KGAA
Reel/Frame 021912/0634 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2005
From: MUSA, OSAMA M.; ZHANG, RUZHI
To: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
Reel/Frame 017902/0129 →