Patent Assignment
Reel/Frame 022309/0718
Change of Name
Recorded: 2008-12-03
Pages: 124
Assignor
HENKEL KGAA
Executed: 2008-04-15
Assignee
HENKEL AG & CO. KGAA
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Properties
(209)
Conductive Materials with Electrical Stability and Good Impact Resistance for Use in Electronics Drive
PCT:
PCT/US2004/004844 ↗
Adhesive for Bag Sealing Application
PCT:
PCT/US2005/018361 ↗
Multi-Layer Adhesive Film for Die Stacking
PCT:
PCT/US2005/046390 ↗
Radiation-Or Thermally-Curable Barrier Sealants
PCT:
PCT/US2006/011441 ↗
Radiation-Curable Rubber Adhesive/Sealant
PCT:
PCT/US2006/011442 ↗
Thermally Curable Epoxy-Amine Barrier Sealants
PCT:
PCT/US2006/012657 ↗
Acrylic Hot Melt Adhesives
PCT:
PCT/US2006/018275 ↗
Acrylic Polymer-Based Adhesives
PCT:
PCT/US2006/037066 ↗
Acrylic Polymer-Based Adhesives
PCT:
PCT/US2006/037067 ↗
Board on Chip Package and Process for Making Same
PCT:
PCT/US2006/044465 ↗
Process for Coating a Bumped Semiconductor Wafer
PCT:
PCT/US2006/047067 ↗
Semiconductor Wafter Coated with a Filled, Spin-Coatable Material
PCT:
PCT/US2007/002740 ↗
Maleimide Containing Ester and Sulfide Functionalities
PCT:
PCT/US2007/003422 ↗
Thermally Conductive Composition
PCT:
PCT/US2007/020018 ↗
Antistatic Protective Hot Melt Adhesives
PCT:
PCT/US2007/023270 ↗
Acrylic Hot Melt Adhesives
PCT:
PCT/US2007/023274 ↗
Composition Containing Porphyrin to Improve Adhesion
PCT:
PCT/US2007/063970 ↗
1,3-Dipolar Cycloaddition of Azides to Alkynes
PCT:
PCT/US2007/074449 ↗
Alcohols Containing Imide Moieties and Reactive Oligomers Prepared Therefrom
PCT:
PCT/US2007/074463 ↗
Lubricant for Hot Forging Applications
PCT:
PCT/US2007/078113 ↗
Electrically Conductive Composition
PCT:
PCT/US2007/078334 ↗
Composition with Thermally-Treated Silica Filler for Performance Enhancement
PCT:
PCT/US2007/083319 ↗
Waterborne Conductive Compositions
PCT:
PCT/US2007/083445 ↗
Method of Containing Resin Bleed
PCT:
PCT/US2007/085258 ↗
Redox-Induced Cationically Polymerizable Compositions with Low Cure Temperature
PCT:
PCT/US2007/085272 ↗
Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same
PCT:
PCT/US2007/085278 ↗
Curable Resins Containing Acetal, Ketal, Acetal Ester, or Ketal Ester Linkages
PCT:
PCT/US2007/086083 ↗
Compounds Having a Diphenyl Oxide Backbone and Maleimide Functional Group
PCT:
PCT/US2007/088130 ↗
Reactive Hot Melt Adhesive with Bituminous Additive
PCT:
PCT/US2008/051882 ↗
Organic Electronic Devices Protected by Elastomeric Laminating Adhesive
PCT:
PCT/US2008/051921 ↗
Curable Compositions Prepared from Multifunctional and Hybrid N-Vinylformamide Compounds
PCT:
PCT/US2008/052983 ↗
Corrugating Adhesive and Use Thereof
PCT:
PCT/US2008/054660 ↗
Die Attach Adhesives for Use in Microelectronic Devices
Patent:
6,265,530 →
Application:
09/336,245 →
Bioadhesive Composition
Foamed adhesive and use thereof
Application:
09/916,779 →
Publication:
US 2003/0026976
Curable Electron Donor Compounds
Die Attach Adhesives with Vinyl Ether and Carbamate or Urea Functionality
Tackified Acrylic Pressure Sensitive Adhesive
Compounds Containing Vinyl Silane and Electron Donor or Acceptor Functionality
Patent:
6,570,032 →
Application:
09/966,448 →
Epoxy Compounds Containing Styrenic or Cinnamyl Functionality
Patent:
6,441,121 →
Application:
09/966,449 →
Adhesion Promoters Containing Benzotriazoles
Vinyl Silane Compounds Containing Epoxy Functionality
Water-based bottle labeling adhesive
Application:
09/969,893 →
Publication:
US 2003/0064178
Fluid Resistant Silicone Encapsulant
Bookbinding Process
Adhesive and Use Thereof
Dual Cure B-Stageable Underfill for Wafer Level
Novel Reagents for Heat Activated Polymer Crosslinking
Adhesive Wafers for Die Attach Application
Adhesive for difficult to bond substrates
Application:
10/053,497 →
Publication:
US 2003/0091760
Bioadhesive Composition
No-Flow Underfill Encapsulant
Curable Compositions Containing Benzoxazine
Patent:
6,620,905 →
Application:
10/080,738 →
Underfill Encapsulant for Wafer Packaging and Method for Its Application
Film Containing Starch
Application:
10/100,260 →
Publication:
US 2003/0099692
Electron Donors, Electron Acceptors and Adhesion Promoters Containing Disulfide
Water Based Adhesive Composition with Release Properties
Curable Compositions Containing Thiazole Functionality
Cycloaliphatic Epoxy Compounds Containing Styrenic, Cinnamyl, or Maleimide Functionality
Remoistenable Pre-Applied Adhesive
Two Part Epoxide Adhesive with Improved Strength
Patent:
6,645,341 →
Application:
10/213,883 →
Hot melt adhesive and use thereof
Application:
10/236,270 →
Publication:
US 2004/0045666
Reactive Hot Melt Adhesive with Non-Polymeric Aromatic Difunctionals
Low Application Temperature Hot Melt Adhesive
Curable Compounds Containing Reactive Groups: Triazine/Isocyanurates, Cyanate Esters and Blocked Isocyanates
Multi-Layer Film Packaging of Hot Melt Adhesive
Moisture Cured Reactive Hot Melt Adhesive with Monofunctional Reactants as Grafting Agents
Toughened Epoxy-Anhydride No-Flow Underfill Encapsulant
Semiconductor Package with a Die Attach Adhesive Having Silane Functionality
Unsaturated Compounds Containing Silane, Electron Donor and Electron Acceptor Functionality
Adhesive with Carboxyl Benzotriazole for Improved Adhesion to Metal Substrates
Method for the Preparation of a Stable Anaerobic//Uv/Visible Light Curable Adhesive
Patent:
6,664,357 →
Application:
10/348,654 →
Envelope Quality Control Apparatus
Hot Melt Adhesive Composition
Conductive Materials with Electrical Stability and Good Impact Resistance for Use in Electronics Devices
Electronic Device Containing Thermal Interface Material
Patent:
6,776,226 →
Application:
10/388,031 →
Reactive Hot Melt Adhesive with Improved Hydrolysis Resistance
Process for Making Pressure Sensitive Adhesive Tapes from Cationic Cure Adhesives
Labeling Adhesive
Oxetane Compounds Containing Maleimide Functionality
Oxetane Compounds Containing Styrenic Functionality
A Method of Attaching a Die to a Substrate Using a Hybrid Oxetane Compound
Oxetane Compounds Containing Cinnamyl Functionality
Patent:
6,753,434 →
Application:
10/430,114 →
Method of Using Pre-Applied Underfill Encapsulant
Pre-Applied Fluxing Underfill Composition Having Pressure Sensitive Adhesive Properties
Method for Pre-Applied Thermoplastic Reinforcement of Electronic Components
Novel Reactive Hot Melt Adhesives
Foamed adhesive and applications thereof
Application:
10/462,183 →
Publication:
US 2004/0250516
Polymeric Photoinitiators
Maleimide Resin with Cyanurate Core
Assembly of a Semiconductor Die Attached to Substrate with Oxazoline Derivative Bearing an Electron Donor or Acceptor Functionality
Low Application Temperature Elastic Attachment Adhesive
Hot melt adhesive
Application:
10/613,409 →
Publication:
US 2005/0003197
Thermal Interface Material
Hot melt adhesive containing a neutralizing additive
Application:
10/635,139 →
Publication:
US 2005/0032963
Hot Melt Adhesive
Hot Melt Adhesive Composition
Sprayable Adhesive Material for Laser Marking Semiconductor Wafers and Dies
Sulfonium Salt Photinitiators and Use Thereof
Uv Curable Protective Encapsulant
Corrugating Method and Means
Patent:
6,827,784 →
Application:
10/748,908 →
Polymer Compounds Containing Oxetane and Cinnamyl Functionality
Fluid Resistant Silicone Encapsulant
Pre-applied thermoplastic reinforcement for electronic components
Application:
10/768,868 →
Publication:
US 2004/0238925
Pre-applied thermoplastic reinforcement for electronic components
Application:
10/768,910 →
Publication:
US 2004/0245611
Ionomer-Containing Hot Melt Adhesive
Adhesive Containing Radial Block Copolymer
Adhesive containing radial block copolymer
Application:
10/779,492 →
Publication:
US 2005/0182194
Elastic attachment adhesive containing radial block copolymer
Waterbased High Abrasion Resistant Coating
Hot melt adhesive composition
Application:
10/786,185 →
Publication:
US 2004/0167258
Ultraviolet-curable waterborne coating
Application:
10/812,134 →
Publication:
US 2005/0215654
Dicing die bonding film
Application:
10/815,420 →
Publication:
US 2005/0227064
Method to Improve High Temperature Cohesive Strength with Adhesive Having Multi-Phase System
Reactive Hot Melt Adhesive with Improved Properties
Unsaturated Compounds Containing Silane, Electron Donor and Electron Acceptor Functionality
Hot Melt Adhesive
Adhesive for bag sealing application
Application:
10/853,750 →
Publication:
US 2005/0276938
Compositions Containing Oxetane Compounds for Use in Semiconductor Packaging
Fluid Resistant Silicone Encapsulant
Fluid Resistant Silicone Encapsulant
Sulfonium salt photoinitiators and use thereof
Application:
10/918,946 →
Publication:
US 2005/0095531
Fire Retardant Foam and Gel Compositions
Curable Electron Donor Compositions
Reactive hot melt adhesive with block acrylic copolymer
Application:
10/968,658 →
Publication:
US 2006/0084755
Method of using pre-applied underfill encapsulant
Application:
10/969,588 →
Publication:
US 2005/0074547
Low temperature snap cure material with suitable worklife
Application:
10/997,350 →
Publication:
US 2006/0111496
Triacetin resistant hot melt adhesive
Application:
11/023,052 →
Publication:
US 2006/0137700
Photoinitiators and Uv-Crosslinkable Acrylic Polymers for Pressure Sensitive Adhesives
Transdermal Drug Delivery Device Comprising an Acrylic Block Copolymer-Based Adhesive
Solution pressure sensitive adhesives based on acrylic block copolymers
Application:
11/047,924 →
Publication:
US 2006/0173124
Package or pre-applied foamable underfill for lead-free process
Application:
11/054,164 →
Publication:
US 2006/0177966
Low Stress Conductive Adhesive
Radiation curable cycloaliphatic barrier sealants
Application:
11/098,115 →
Publication:
US 2006/0223937
Cationically curable oxetane and cationic initiator
Application:
11/098,116 →
Publication:
US 2006/0223978
Radiation-Curable Desiccant-Filled Adhesive/Sealant
Polymer Compounds Containing Oxetane and Styrenic Functionality
Polymer Compounds Containing Oxetane and Maleimide Functionality
Weatherstrip coating
Application:
11/146,267 →
Publication:
US 2006/0276599
System for dispensing viscous liquids
Application:
11/152,430 →
Publication:
US 2005/0274740
Metal salts of maleimide compounds as conductivity promoters
Application:
11/157,611 →
Publication:
US 2006/0284141
Semiconductor assembly using dual-cure die attach adhesive
Application:
11/168,037 →
Publication:
US 2005/0238881
Process for Exposing Solder Bumps on an Underfill Coated Semiconductor
Thermal interface material
Application:
11/178,138 →
Publication:
US 2005/0250910
Activatable compositions
Application:
11/181,381 →
Publication:
US 2007/0014985
Use of foamed adhesives to make paper cores or tubes
Application:
11/199,324 →
Publication:
US 2005/0271839
Quinolinols as Fluxing and Accelerating Agents for Underfill Compositions
Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives
Application:
11/211,920 →
Publication:
US 2007/0049665
Mucosal delivery tablet
Application:
11/212,437 →
Publication:
US 2007/0048369
Metal Salts of Quinolinols and Quinolinol Derivatives in Curable Compositions
Acrylic pressure sensitive adhesives
Application:
11/238,277 →
Publication:
US 2007/0071800
Foamed adhesive for casing-in
Application:
11/244,799 →
Publication:
US 2007/0081875
Integrated Low Application Temperature Hot Melt Adhesive Processing System
Thermoset Adhesive Films
Rfid Antenna with Pre-Applied Adhesives
Boron Nitride Based Lubricant Additive
Application:
11/275,506 →
Publication:
US 2007/0161518
Thermally conductive acrylic polymer composition
Application:
11/275,786 →
Publication:
US 2007/0179232
Hot melt adhesives for medical application
Application:
11/282,510 →
Publication:
US 2006/0110596
Adhesive containing block copolymers
Application:
11/284,102 →
Publication:
US 2007/0117934
B-Stageable Underfill Encapsulant and Method for Its Application
Adhesive Composition
Method of preparing filters
Application:
11/291,367 →
Publication:
US 2006/0117728
Foamable underfill encapsulant
Application:
11/333,940 →
Publication:
US 2006/0142424
Underfill encapsulant for wafer packaging and method for its application
Application:
11/351,647 →
Publication:
US 2006/0194064
Peelable Hot Melt Adhesive
Curable Materials Containing Siloxane
Application:
11/369,429 →
Publication:
US 2007/0212556
Reactive hot melt adhesive with non-polymeric aliphatic difunctionals
Application:
11/372,785 →
Publication:
US 2006/0210808
Adhesive of Solid Epoxy, Latent Hardener, Thixotropic Agent and Solvent
Application:
11/373,437 →
Publication:
US 2007/0212551
Anisotropic conductive adhesive
Application:
11/373,484 →
Publication:
US 2007/0213429
Method for reducing freeze-thaw voids in uncured adhesives
Application:
11/402,170 →
Publication:
US 2006/0210748
Hot melt adhesive for packaging applications
Application:
11/409,136 →
Publication:
US 2007/0249771
Use of Debranched Starch in Extrusion-Spheronization Pharmaceutical Pellets
System for concealing joints
Application:
11/414,992 →
Publication:
US 2007/0254151
Compositon useful for delivery of active agents
Application:
11/418,289 →
Publication:
US 2006/0251585
Absorbent Articles Comprising a Radiation Cured Hot Melt Positioning Adhesive
Two Component Polyurethane Adhesive
Low viscosity curable compositions
Application:
11/450,486 →
Publication:
US 2007/0287775
Radiation curable cycloaliphatic barrier sealants
Application:
11/474,772 →
Publication:
US 2007/0117917
Optoelectronic Device Sealed With Sealant of Oxetane Compound and Cationic Initiator
Application:
11/502,707 →
Publication:
US 2007/0034515
Thermally conductive material
Application:
11/502,708 →
Publication:
US 2008/0039555
Siloxane Resins with Oxetane Functionality
Moisture cured reactive hot melt adhesive with monofunctional reactants as grafting agents
Dicing die bonding film
Application:
11/514,556 →
Publication:
US 2007/0003758
Acrylic polymer-based adhesives
Application:
11/526,131 →
Publication:
US 2007/0072986
Acrylic polymer-based adhesives
Application:
11/526,135 →
Publication:
US 2007/0072987
Metal salts of quinolinols and quinolinol derivatives as corrosion inhibitors
Application:
11/545,238 →
Publication:
US 2007/0072968
Lubricant for Hot Forging Applications
Waterbased low noise generating coating
Application:
11/546,890 →
Publication:
US 2008/0090948
Polymeric Photoinitiators
Polymeric Photoinitiators
Process to generate water based adhesives and their use
Application:
11/630,853 →
Publication:
US 2010/0027370
Waterborne Adhesive
Product and Method for Concealing Joints
Reactive Hot Melt Adhesive with Bituminous Additive
Conductive Materials
Low Application Temperature Hot Melt Adhesive
Electrically Conductive Uv-Curable Ink
Compositions for Use in Electronics Devices
Application:
11/734,988 →
Publication:
US 2008/0054227
Corrosion-Preventive Adhesive Compositions
Application:
11/752,591 →
Publication:
US 2008/0292801
Sulfonium Salt Photoinitiators and Use Thereof
Method of Fluxing Using Fluxing Compositions Containing Benzotriazoles
Application:
11/828,640 →
Publication:
US 2007/0277907
Reactive Hot Melt Adhesive
UV Curable Coating Composition
Highly Conductive Composition for Wafer Coating
Application:
11/941,498 →
Publication:
US 2008/0166543
Moisture Curable Hot Melt Adhesive
Application:
11/961,345 →
Publication:
US 2009/0159206
Insulation and Method of Installing
Application:
11/964,268 →
Publication:
US 2009/0165942
Hot Melt Adhesive
Corrosion-Resistant Anisotropic Conductive Compositions
Application:
60/912,223 →
Thermally-Conductive Compositions
Application:
60/912,236 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 19, 2008
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION; INDOPCO, INC.
To: HENKEL KGAA
Reel/Frame 021912/0634 →
Assignment of Assignor's Interest
Jul 19, 2010
From: MUSA, OSAMA M.; HERR, DONALD E.
To: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
Reel/Frame 024705/0079 →
Assignment of Assignor's Interest
Aug 29, 2016
From: FOREMAN, PAUL B.; RICHARDSON, PAUL; TSAI, JOHN; REMON, JEAN PAUL
To: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
Reel/Frame 039562/0830 →
Assignment of Assignor's Interest
Aug 29, 2016
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
To: REMON, JEAN PAUL; VOORSPOELS, JODY; AMEYE, DIETER; CALLENS, CATHERINE
Reel/Frame 039562/0930 →
Assignment of Assignor's Interest
Aug 29, 2016
From: REMON, JEAN PAUL; VOORSPOELS, JODY; AMEYE, DIETER; CALLENS, CATHERINE
To: UNIVERSITEIT GENT
Reel/Frame 039562/0987 →