Semiconductor assembly using dual-cure die attach adhesive

1 - 8 . (canceled)

9 . An assembly comprising a substrate for use within a semiconductor package and a B-stageable adhesive deposited on the substrate,

the B-stageable adhesive comprising two chemical compositions,

(i) a first composition comprising a curable monomeric or polymeric compound or resin and a curing initiator or curing agent for that compound or resin, and

(ii) a second composition comprising a monomeric or polymeric compound or resin and a curing initiator or curing agent for that compound or resin,

in which the curing temperatures or curing temperature ranges are sufficiently separated to allow the composition with the lower curing temperature, the first composition, to cure without curing the composition with the higher curing temperature, the second composition,

and characterized in that the first composition is fully cured and the second composition is uncured.

10 . The assembly according to claim 9 in which the curing temperatures of the first and second compositions are separated by 30° C. or greater.

11 . The assembly according to claim 9 in which the first composition is selected from the group consisting of acrylic compounds or resins; cycloaliphatic epoxy compounds or resins, bismaleimide compounds or resins; and bismaleimide compounds or resins in combination with vinyl ether, vinyl silane, styrenic or cinnamyl compounds or resins.

12 . The assembly according to claim 9 in which the second composition is an epoxy compound or resin.

13 . The assembly according to claim 13 further comprising an imidazole/anhydride adduct.

14 . The assembly according to claim 14 in which the imidazole/anhydride adduct is a complex of 1 part 1,2,4,5-benzene-tetracarboxylic anhydride and 4 parts 2-phenyl-4-methyl-imidazole, or a complex of 1 part 1,2,4,5-benzenetetracarboxylic dianhydride and 2 parts 2-phenyl-4-methylimidazole.