Process for exposing solder bumps on an underfill coated semiconductor
View Patent ↗A process for applying a solvent-free underfill onto a bumped semiconductor comprises: providing an underfill in a compressible state on a semiconductor, contacting the underfill with a compliant surface and applying sufficient pressure to expose the bumps, optionally hardening the underfill to a solid state, and removing the compliant surface.
1. A process for applying a solvent-free underfill onto a semiconductor having an array of solder bumps on a surface of the semiconductor, the process comprising:
i. providing an underfill in a compressible state on the semiconductor,
ii. contacting the underfill with a compliant surface and applying sufficient pressure to expose the solder bumps on the surface of the semiconductor,
iii. hardening the underfill to a solid state, and
iv. removing the compliant surface.
2. The process of claim 1 in which the underfill is provided by depositing it as a solid powder on the semiconductor and is converted to a compressible state by melting.
3. The process of claim 1 in which the underfill is deposited as a liquid onto the semiconductor.
4. The process of claim 1 in which the underfill is a curable epoxy resin.
5. The process of claim 1 in which the compliant surface is a silicone rubber.
6. The process of claim 1 in which the semiconductor is a silicon die.
7. The process of claim 1 in which the semiconductor is a silicon wafer.
8. A process for applying a solvent-free underfill onto a semiconductor having an array of solder bumps on a surface of the semiconductor, the process comprising:
v. providing an underfill in a compressible state on the semiconductor,
vi. contacting the underfill with a compliant surface and applying sufficient pressure to expose the solder bumps on the surface of the semiconductor,
vii. removing the compliant surface.
9. The process of claim 8 in which the underfill is provided by depositing it as a solid powder on the semiconductor and is converted to a compressible state by melting.
10. The process of claim 8 in which the underfill is deposited as a liquid onto the semiconductor.
11. The process of claim 8 in which the underfill is a curable epoxy resin.
12. The process of claim 8 in which the compliant surface is a silicone rubber.
13. The process of claim 8 in which the semiconductor is a silicon die.
14. The process of claim 8 in which the semiconductor is a silicon wafer.