IP Library Assignment 016577/0406
Patent Assignment
Reel/Frame 016577/0406

Assignment of Assignor's Interest

Recorded: 2005-07-27 Pages: 5
Assignors
CHAWARE, RAGHUNANDAN
Executed: 2005-06-10
DOMINIC, CHRISTOPHER
Executed: 2005-06-23
Assignee
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
1000 UNIQEMA BOULEVARD, NEW CASTLE, DELAWARE, 19720
Covered Property (1)
Process for Exposing Solder Bumps on an Underfill Coated Semiconductor
Patent: 7,338,842 →
Application: 11/168,236 →
Publication: US 2007/0020815
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 19, 2008
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION; INDOPCO, INC.
To: HENKEL KGAA
Reel/Frame 021912/0634 →
Change of Name Dec 3, 2008
From: HENKEL KGAA
To: HENKEL AG & CO. KGAA
Reel/Frame 022309/0718 →