IP Library › Patent Application 11402170
Patent Application
App. No. 11/402,170

Method for reducing freeze-thaw voids in uncured adhesives

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Quick Facts
Patent No.
US None
App. No.
11/402,170
Abstract

A method for reducing the level of freeze-thaw voids in an uncured adhesive subjected to freezing and thawing comprises storing the adhesive in a container in which the walls of the container are a thermoplastic material and have been thinned and roughened.

Claims (5)

1 - 7 . (canceled)

8 . A container in which the walls of the container are a thermoplastic material and

(i) have a thickness of 0.0254 mm to 0.762 mm or

(ii) have a thickness of 0.0254 to 1.524 mm and are roughened to have a mean roughness value of greater than 0.3 μm.

9 . The container according to claim 8 in which the container is a syringe or a syringe within a rigid sleeve.

Assignments (2)
CHANGE OF NAME Recorded Dec 3, 2008
From: HENKEL KGAA
To: HENKEL AG & CO. KGAA
Reel/Frame 022309/0718 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2008
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION; INDOPCO, INC.
To: HENKEL KGAA
Reel/Frame 021912/0634 →