Method of attaching a die to a substrate using a hybrid oxetane compound
View Patent ↗A method for attaching a silicon die to a substrate using an adhesive containing an oxetane functionality and an electron acceptor or an electron donor functionality, represented by the formula in which R 1 is a methyl or ethyl group, R 2 is a divalent hydrocarbon, X and Y are independently a direct bond, or an ether, ester, or carbamate functionality, Q is a divalent hydrocarbon, and F is an electron donor or electron acceptor functionality.
1. A method of attaching a silicon die to a substrate comprising disposing an adhesive between the die and the substrate and curing the adhesive with heat, in which the adhesive is a curable composition comprising
(a) a compound containing an oxetane functionality and an electron donor or electron acceptor functionality, represented by the formula
in which
R 1 is a methyl or ethyl group,
R 2 is a divalent hydrocarbon,
Q is a divalent hydrocarbon,
X and Y are indelendently a direct bond, or an ether, ester, or carbamate functionality, provided that X and Y are not both direct bonds, and
E is a styrenic, cinnamyl, vinyl ether, maleimide, acrylate, fumarate, or maleate group;
(b) a curing agent, and
(c) a filler.
2. The method according to claim 1 in which E is a maleimide or cinnamyl group.