IP Library › Granted Patent US 7,230,055
Granted Patent B2
US 7,230,055 · App. 10/901,631 · Granted Jun 12, 2007

Compositions containing oxetane compounds for use in semiconductor packaging

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Quick Facts
Patent No.
US 7,230,055
App. No.
10/901,631
Granted
Jun 12, 2007
Kind
B2
Abstract

Compositions containing oxetane compounds having ester, amide, urea, carbamate, carbonate, or carbonyl functionality one carbon atom removed from the oxetane ring cure at high temperatures are suitable for use as underfill materials within a semiconductor package, particularly in applications using lead free solder electrical interconnections. A suitable oxetane compound has the structure:

Claims (3)

1. A curable composition comprising an oxetane compound selected from the group consisting of

2. The curable composition according to claim 1 further comprising a cyanate ester compound.

3. The curable composition according to claim 1 further comprising an epoxy, a resin having a carbon to carbon double bond, or both.

Assignments (3)
CHANGE OF NAME Recorded Dec 3, 2008
From: HENKEL KGAA
To: HENKEL AG & CO. KGAA
Reel/Frame 022309/0718 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2008
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION; INDOPCO, INC.
To: HENKEL KGAA
Reel/Frame 021912/0634 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2004
From: MUSA, OSAMA M.
To: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
Reel/Frame 015644/0215 →