UV curable protective encapsulant
View Patent ↗The present invention discloses encapsulant materials for use in glob top and/or dam and fill applications comprising base oligomer/monomers preferably having an acrylated/methacrylated or vinylene-containing oligomer/polymer, one or more multifunctional acrylate monomers, one or more thixotropic agents and, optionally, fillers, additives, photoinitiators and/or pigments. The encapsulant has low levels of water absorption and shrinkage.
1. An encapsulation composition comprising one or more base oligomer/polymers; one or more diacrylate monomers selected from the group consisting of tricyclodecane dimethanol diacrylate, hydroxypivalaldehyde modified trimethyloipropane diacrylate and mixtures thereof; one or more thixotropic agents; and one or more filler materials selected from the group consisting of spherical hollow glass beads, solid glass beads, talc, spherical silica and mixtures thereof.
2. The encapsulation composition of claim 1 , wherein the diacrylate monomer is tricyclodecane dimethanol diacrylate.
3. The encapsulation composition of claim 1 , wherein the one or more base oligomer/polymers is an acrylated/methacrylated or vinylene-containing oligomer/polymer.
4. The encapsulation composition of claim 1 , wherein the thixotropic agent is treated silica.
5. The encapsulation composition of claim 1 , further comprising a silane coupling agent.
6. The encapsulation composition of claim 1 , wherein the one or more base oligomer/polymers comprises in the range of about 1 to about 75 weight percent of the composition.
7. The encapsulation composition of claim 6 , wherein the one or more base oligomer/polymers comprises in the range of about 20 to about 50 weight percent of the composition.
8. The encapsulation composition of claim 1 , wherein the one or more diacrylate monomers comprise in the range of about 1 to about 50 weight percent of the composition.
9. The encapsulation composition of claim 8 , wherein the one or more diacrylate monomers comprise in the range of about 10 to about 30 weight percent of the composition.
10. The encapsulation composition of claim 1 , wherein the thixotropic agent comprises in the range of about 0.1 to about 8 weight percent of the composition.
11. The encapsulation composition of claim 10 , wherein the thixotropic agent comprises in the range of about 2 to about 5 weight percent of the composition.
12. The encapsulation composition of claim 1 , wherein the one or more filler materials comprise in the range of about 1 to about 85 weight percent of the composition.
13. The encapsulation composition of claim 12 , wherein the one or more filler materials comprise in the range of about 50 to about 75 weight percent of the composition.
14. A method of providing encapsulation on an electronic component comprising the step of applying the composition of claim 1 to an electronic component.