Integrated low application temperature hot melt adhesive processing system

1. An integrated system for the processing of low application temperature hot melt adhesives comprising:

(a) a low application temperature hot melt adhesive selected from the group consisting of ethylene/vinyl acetate copolymer, ethylene n-butyl acrylate, isotactic polypropylene, atactic polypropylene, styrene-isoprene, styrene-ethylene-butylene block copolymer and mixtures thereof;

(b) a melt tank having a interior cavity adapted to receive said adhesive, wherein the melt tank comprises a heating means and is connected to a dispensing pump;

(c) an auto feed device integrally connected to the melt tank; and

(d) a hose connected to the melt tank, and the hose is a transporting means for said adhesive onto a substrate surface;

wherein the hot melt adhesive is automatically fed by the auto feed device into the melt tank; and

wherein the melt tank comprises heating elements that are controlled to reach a maximum operating temperature of 250° F.

2. The system of claim 1 wherein the system is programmed to operate at temperatures of about 225° F. or lower.

3. The system of claim 1 comprising

(1) a feed tank for maintaining a supply of said adhesive in its solid form,

(2) a supply passage connected to said feed tank for supplying said adhesive to the interior cavity of said melt tank,

(3) a supply port in communication with the interior cavity of the melt tank and connected to the supply passage,

(4) a nozzle mounting port including a dispensing orifice which is opened and closed by a valve, and

(5) a heated transport hose and a nozzle for dispensing said adhesive in its molten form from the dispensing orifice.

4. The system of claim 1 wherein the dispensing pump is a piston pump.

5. The apparatus system of claim 1 wherein the dispensing pump is a gear pump.

6. The system of claim 1 comprising an adhesive inlet valve for introducing solid adhesive into the auto feed device.

7. The system of claim 1 comprising a means for automatically maintaining adhesive level.

8. The system of claim 1 wherein the low application temperature hot melt adhesive comprises ethylene/vinyl acetate copolymer, ethylene n-butyl acrylate, isotactic polypropylene, atactic polypropylene, styrene-isoprene, styrene-ethylene-butylene block copolymer and mixtures thereof.

9. The system of claim 8 wherein the low application temperature hot melt adhesive further comprises a tackifying resin, oil plasticizer, wax and/or additives.

10. The system of claim 9 wherein the additives include stabilizers, anti-oxidant and/or pigments.