IP Library Granted Patent US 7,326,754
Granted Patent B2
US 7,326,754 · App. 11/248,490 · Granted Feb 5, 2008

Thermoset adhesive films

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Quick Facts
Patent No.
US 7,326,754
App. No.
11/248,490
Granted
Feb 5, 2008
Kind
B2
Abstract

This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

Claims (6)

1. A rubbery film adhesive prepared from materials consisting essentially of:

a rubbery polymer prepared from acrylic, vinyl, or conjugated diene monomers, substituted with both pendant electron donor and pendant electron acceptor functionality, and having a weight average molecular weight in the range of 300,000 to 1,500,000, and

a free radial initiator;

characterized in that the film adhesive can be cured within two minutes at a temperature below 300° C.

2. The film adhesive according to claim 1 in which the rubbery polymers are acrylics, styrene-acrytic copolymers, or acrylonitrile-butadiene copolymers, or combinations of those.

3. The film adhesive according to claim 1 further comprising a vinyl ether selected from the group consisting of bis[4-(vinyloxy)-butyl]terephthalate, bis[4-(vinyloxy)butyl](4-methyl-1,3-phenylene)-biscarbamate, bis[4-(vinyloxy) butyl]1,6-hexanediylbiscarbamate, 4-(vinyloxy)-butyl stearate, and bis[4-(vinyloxy) butyl)](methylenedi-4,1-phenylene)-biscarbamate.

Assignments (2)
CHANGE OF NAME Recorded Dec 3, 2008
From: HENKEL KGAA
To: HENKEL AG & CO. KGAA
Reel/Frame 022309/0718 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2008
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION; INDOPCO, INC.
To: HENKEL KGAA
Reel/Frame 021912/0634 →