Thermally conductive material
A low viscosity composition for use in varying applications, such as an encapsulant, anti-corrosive, adhesive and/or thermal interface material in an electronic device is provided. The composition comprises a blend one or more resins, one or more curing agents, one or more reactive diluents and one or more thermally conductive filler having particles with a high aspect ratio.
1 . A thermally conductive composition comprising one or more curable resins, one or more curing agents, and thermally conductive particles, and optionally one or more diluents, wherein at least a portion of the thermally conductive particles have a high aspect ratio.
2 . The composition of claim 1 , wherein the one or more curable resins are selected from the group consisting of monofunctional and multifunctional glycidyl ethers of Bisphenol-A and Bisphenol-F, aliphatic and aromatic epoxies, saturated and unsaturated epoxies, phenolic epoxies, phenol novolac epoxies, non-glycidyl ether epoxy resins, cycloaliphatic epoxy resins, glycidyl ether epoxies, epoxy functional butadiene acrylonitrile, epoxy functional polydimethyl siloxane, epoxidized diolefins, vinylcyclohexene dioxide, 3,4-epoxy-6-methyl cyclohexyl methyl-3,4-epoxycyclohexane carboxylate and dicyclopentadiene dioxide silicone, cyanate ester, urethane, acrylate, bismaleimide or mixtures thereof.
3 . The composition of claim 1 , wherein the one or more curing agents are selected from the group consisting of amines, anhydrides, phenol compounds, dicyanediamine, blocked imidazoles, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole or mixtures thereof.
4 . The composition of claim 1 , wherein the one or more diluents are selected from the group consisting of glycidyl ethers, 1,4-butanediol diglycidyl ether; p-tert-butyl-phenyl glycidyl ether, allyl glycidyl ether, glycerol diglycidyl ether, glycidyl ether of alkyl phenol and mixtures thereof.
5 . The composition of claim 1 , wherein the thermally conductive particles are selected from the group consisting of silica, alumina, nano silica, nano alumina, zinc oxide, magnesium oxide, boron nitride, aluminum nitride.
6 . The composition of claim 1 , wherein at least a portion of the thermally conductive particles have a length to width aspect ratio of greater than 1.0
7 . The composition of claim 6 , wherein the length to width aspect ratio is in the range of greater than 1.0 to about 2.5.
8 . The composition of claim 1 , wherein at least a portion of the thermally conductive particles have a geometrically smooth surface.
9 . The composition of claim 1 further comprising one or more of the group consisting of surface active agents, surfactants, wetting agents, antioxidants, thixotropes, reinforcement materials, silane functional perfluoroether, phosphate functional perfluoroether, silanes, titanates, wax, phenol formaldehyde, air release agents, flow additives, adhesion promoters, rheology modifiers, surfactants, spacer beads and mixtures thereof.
10 . The composition of claim 1 , wherein the composition is in the form of a paste.
11 . The composition of claim 1 , wherein the one or more curable resins comprise in the range of about 5 to about 40 weight percent of the composition.
12 . The composition of claim 1 , wherein the one or more curing agents comprise in the range of about 0.1 to about 30 weight percent of the composition.
13 . The composition of claim 2 , wherein the one or more diluents comprise in the range of about 2 to about 20 weight percent of the composition.
14 . The composition of claim 1 , wherein the one or more thermally conductive particles comprise in the range of about 25 to about 95 weight percent of the composition.
15 . An adhesive for use in electronic devices comprising the thermally conductive composition of claim 1 .
16 . A thermal interface material for use in electronic devices comprising the thermally conductive composition of claim 1 .
17 . An encapsulant for use in electronic devices comprising the thermally conductive composition of claim 1 .
18 . An anti-corrosion composition for use in electronic devices comprising the thermally conductive composition of claim 1 .
19 . An electronic device comprising the thermally conductive composition of claim 1 .
20 . A method of transferring heat from in one or more electronic components utilizing the thermally conductive composition of claim 1 .