Adhesive composition
An adhesive utilized in various electronic applications. One such adhesive is a B-stageable adhesive that offers excellent adhesion to electronic components, such as lids and substrates comprising various materials, including liquid crystal polymer. The adhesive provides latency and the ability to provide a thorough seal between lids and substrates, including those comprising LCP. The adhesive comprises a solvent, one or more solid epoxies, one or more latent hardeners and one or more thixotropic agents.
1 . An adhesive for use in electronic components comprising one or more solid epoxies, one or more latent hardeners, one or more thixotropic agents, and one or more solvents.
2 . The adhesive of claim 1 , wherein at least one of the one or more solid epoxies is a flexibilized epoxy.
3 . The adhesive of claim 1 , wherein the one or more solid epoxies are selected from the group consisting of epoxy functional butadiene, epoxy functional silicone, epoxy functional acrylic rubber, epoxy functional nitrile rubber, epoxy-CTBN adducts, epoxy-urethane adducts and mixtures thereof.
4 . The adhesive of claim 1 , wherein the one or more latent hardeners comprise one or more imidazoles.
5 . The adhesive of claim 1 , wherein one or more of the latent hardeners is microencapsulated.
6 . The adhesive of claim 4 , wherein the one or more imidazoles are selected from the group consisting of non-N-substituted imidazoles, 2-phenyl-4-methyl imidazole, 2-ethyl-4-methyl-imidazole, 2-phenyl imidazole, alkyl-substituted imidazole, N-substituted imidazole and mixtures thereof.
7 . The adhesive of claim 1 , wherein the one or more solvents are selected from the group consisting of ketones, esters, alcohols, ethers, γ-butyrolactone, acetates, propylene glycol methyl ethyl acetate and mixtures thereof.
8 . The adhesive of claim 1 , wherein the one or more thixotropic agents are selected from the group consisting of inorganic fillers, metal fillers, organic thixotropes and mixtures thereof.
9 . The adhesive of claim 1 , further comprising a liquid epoxy component.
10 . The adhesive of claim 1 , further comprising one or more of the group consisting of diluents, surfactants, coupling agents, air release agents, flow additives, adhesion promoters and mixtures thereof.
11 . The adhesive of claim 1 , wherein the adhesive is capable of application to a component as a B-stageable, tack free composition.
12 . The adhesive of claim 1 , wherein the adhesive comprises from about 50 to about 90 weight percent epoxy.
13 . The adhesive of claim 1 , wherein the adhesive comprises from about 30 to about 50 weight percent solvent.
14 . The adhesive of claim 1 , wherein the adhesive comprises from about 2 to about 20 weight percent latent hardener.
15 . The adhesive of claim 1 , wherein the adhesive comprises from about 0 . 1 to about 10 weight percent thixotropic agent.
16 . The adhesive of claim 1 , wherein the adhesive cures in less than about ten minutes at temperatures in the range of about 170° C.
17 . The adhesive of claim 1 , wherein the adhesive cures in less than about five minutes at temperatures in the range of about 180° C.
18 . The adhesive of claim 11 , wherein the adhesive has a shelf life of greater than two months at 25° C. after it is applied to the component.
19 . The adhesive of claim 1 , wherein the adhesive adheres to liquid crystal polymer surfaces.
20 . The adhesive of claim 1 , wherein the adhesive further comprises one or more conductive fillers.
21 . The adhesive of claim 1 , wherein the adhesive further comprises one or more non-conductive fillers.
22 . A method of sealing a lid to a substrate in an electronic assembly comprising the steps of applying the adhesive of claim 1 to the lid and contacting the lid with the substrate.
23 . The method of claim 22 comprising the further step of applying heat and/or pressure to the lid and substrate.
24 . A method of sealing a lid to a liquid crystal polymer substrate in an electronic assembly comprising the steps of applying the adhesive of claim 1 to the lid and contacting the lid with the substrate.
25 . The method of claim 24 comprising the further step of applying heat and/or pressure to the lid and substrate.
26 . An electronic device having the adhesive of claim 1.