Low application temperature elastic attachment adhesive
View Patent ↗Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275° F. of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.
1. A low application temperature thermoplastic hot melt adhesive comprising from about 0.5 to about 55 wt % of a thermoplastic elastomer, from about 30 to about 90 wt % of a tackifying resin, from about 0.1 to about 40 wt % of an ionomer resin, from 0 to about 40 wt % of a diluent and from 0 to about 25 wt % of a wax, and wherein the adhesive has a viscosity at 275° F. of less than about 8,000 centipose, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 25%.
2. The adhesive of claim 1 comprising from about 0.1 to about 15 wt % of said ionomer resin.
3. The adhesive of claim 2 wherein the thermoplastic elastomer is styrene-isoprene-styrene, styrene-butadiene-styrene, styrene-b-ethylene/butylene-b-styrene or a mixture thereof.
4. An article of manufacture comprising the adhesive of claim 1 .
5. The article of claim 4 which is a disposable absorbent article.
6. The article of claim 5 which is a disposable elastic article.
7. The article of claim 6 which is a diaper.
8. The article of claim 4 wherein the article of manufacture further comprises an elastomeric fiber selected from the group consisting of natural rubber, synthetic rubber, spandex, and melt-spun elastomers.
9. The adhesive of claim 1 which is applied at a temperature of from about 270° F. to about 285° F.