Analyzing interconnect structures
View Patent ↗In one embodiment, an interconnect structure may be analyzed to determine electromagnetic characteristics of the structure by identifying structure seeds corresponding to the structure; modeling the structure seeds to obtain field patterns; and processing the field patterns to obtain the electromagnetic characteristics.
1. A method comprising:
identifying a first seed and a second seed each corresponding to a three dimensional interconnect structure having a plurality of layers, each seed including a unique two dimensional cross section of the three dimensional interconnect structure;
forming a first two dimensional model of the first seed in the frequency domain to obtain a first two dimensional electromagnetic field;
forming a second two dimensional model of the second seed in the frequency domain to obtain a second two dimensional electromagnetic field;
determining a first mode of operation and a second mode of operation for the first seed;
determining a third mode of operation and a fourth mode of operation for the second seed;
mode matching to obtain a first weighting coefficient for the first mode, a second weighting coefficient for the second mode, a third weighting coefficient for the third mode, and a fourth weighting coefficient for the fourth mode;
forming a three dimensional model based on the first two dimensional electromagnetic field, the second two dimensional electromagnetic field, the first weighting coefficient, the second weighting coefficient, the third weighting coefficient, and the fourth weighting coefficient.
2. The method of claim 1 , wherein the first mode and the second mode are each forward propagation modes and the third mode and the fourth modes are each backward propagation modes.