Stereolithographic method and apparatus for packaging electronic components
View Patent ↗A stereolithographic method and apparatus for applying packaging material to workpieces, such as preformed electronic components, including semiconductor dice, with a high degree of precision, and resulting articles. A machine vision system including at least one camera is operably associated with a computer controlling a stereolithographic system for application of material so that the system may recognize the position and orientation of workpieces, such as semiconductor dice, to which the material is to be applied. The requirement for precise mechanical workpiece alignment is eliminated, and the ability of the system to recognize size, configuration and topography of different workpieces affords greater manufacturing flexibility. The method includes stereolithographic application of material for packaging electronic components, and the electronic components so packaged are also part of the invention.
1. A method of fabrication of articles, comprising:
placing a plurality of workpieces at a common horizontal plane;
recognizing a location and orientation of each workpiece of the plurality; and
using the recognized location and orientation of each workpiece of the plurality, stereolithographically forming a structure comprising a plurality of layers of at least semisolid material by selectively curing portions of a curable liquid material at locations abutting each of the plurality of workpieces.
2. The method of claim 1 , further comprising storing data including at least one physical parameter of the workpieces in computer memory, and using the stored data in conjunction with a machine vision system to recognize the location and orientation of the workpieces.
3. The method of claim 2 , further comprising using the stored data, in conjunction with the machine vision system, to selectively form at least one layer of the plurality of layers of the at least semisolid material stereolithographically over at least one portion of an upper surface of each of the workpieces of the plurality.
4. The method of claim 1 , further comprising using the stored data, in conjunction with the machine vision system, to form sidewalls comprising at least one layer of the at least semisolid material about each of the workpieces of the plurality.
5. The method of claim 1 , wherein the workpieces of the plurality comprise semiconductor dice, and further including securing the plurality of semiconductor dice to lead frames of a lead frame strip prior to placing the plurality of semiconductor dice at the common horizontal plane.
6. The method of claim 1 , wherein the workpieces of the plurality comprise semiconductor dice, and further including securing each semiconductor die of the plurality to a carrier substrate prior to placing the plurality of semiconductor dice at the common horizontal plane.
7. The method of claim 1 , further comprising, after stereolithographically forming the structure comprising a plurality of layers of at least semisolid material:
inverting the plurality of workpieces and placing the plurality of workpieces at a common horizontal plane;
recognizing a location and orientation of each inverted workpiece of the plurality; and
stereolithographically forming another structure comprising at least one layer of at least semisolid material abutting each of the plurality of workpieces.
8. The method of claim 7 , further comprising storing data including at least one physical parameter of the workpieces in computer memory, and using the stored data in conjunction with a machine vision system to recognize the location and orientation of the workpieces.
9. The method of claim 8 , further comprising using the stored data, in conjunction with the machine vision system, to selectively form the at least one layer of semisolid material stereolithographically of the another structure on at least one portion of an upper surface of each of the workpieces of the plurality.
10. The method of claim 8 , further comprising using the stored data, in conjunction with the machine vision system, to sequentially form sidewalls comprising a plurality of superimposed, contiguous, mutually adhered layers of the at least semisolid material about each of the workpieces of the plurality.
11. The method of claim 7 , wherein the plurality of workpieces comprises semiconductor dice, and further including securing the plurality of semiconductor dice to lead frames of a lead frame strip prior to placing the plurality of semiconductor dice at the common horizontal plane.
12. The method of claim 7 , wherein the plurality of workpieces comprises semiconductor dice, and further including securing each semiconductor die of the plurality to a carrier substrate prior to placing the plurality of semiconductor dice at the common horizontal plane.
13. An apparatus for fabrication of articles, comprising:
a stereolithographic system structured for selective transformation of portions of material in a flowable state to at least a semisolid state in;
a machine vision system in operable communication with the stereolithographic system including at least one camera oriented for detecting objects within the vision field;
a computer in operable communication with both the stereolithographic system and the machine vision system, the computer being programmed to respond to input from the machine vision system indicative of a presence, location and orientation of at least one workpiece in the vision field and to initiate and control the stereolithographic system to selectively transform portions of material in a flowable state to at least a semisolid state at locations abutting the at least one workpiece to form at least one structure comprising a plurality of layers of at least semisolid material abutting the at least one workpiece.
14. The apparatus of claim 13 , further including memory in operable communication with the computer, wherein the memory includes at least one data file representative of at least one physical parameter of the at least one workpiece, and the computer is programmed to employ the at least one data file at least in part to determine the presence, location and orientation of the at least one workpiece in the vision field.
15. The apparatus of claim 14 , wherein the computer is programmed to employ the at least one data file at least in part to select a location and configuration of the at least one structure formed abutting the at least one workpiece.
16. The apparatus of claim 15 , wherein the computer is programmed to employ the at least one data file at least in part to detect a presence of a physically defective workpiece in the vision field.
17. The apparatus of claim 16 , wherein the at least one workpiece comprises a plurality of workpieces disposed at a common horizontal plane.
18. The apparatus of claim 17 , wherein the plurality of workpieces each have at least one differing physical parameter, and the at least one data file comprises a plurality of data files, each data file of the plurality representative of the at least one differing physical parameter, and the computer is programmed to employ the plurality of data files at least in part to recognize the plurality of workpieces differing in at least one physical parameter as being different.