Thin film forming method
View Patent ↗A method for forming thin films of a semiconductor device is provided. The thin film formation method presented here is based upon a time-divisional process gas supply in a chemical vapor deposition (CVD) method, where the process gases are supplied and purged sequentially, and additionally plasma is generated in synchronization with the cycle of pulsing reactant gases. A method of forming thin films that possess a property of gradient composition profile is also presented.
1. A method of forming a metal oxide layer on a substrate in a reactor using plasma in space reactor of an atomic layer deposition apparatus, the method comprising a plurality of cycles of source pulses, comprising:
supplying a metallic source compound into the reactor;
supplying oxygen gas into the reactor between supplying the metallic source compound and subsequent generation of a plasma;
thereafter, generating the plasma directly in the reactor while continuing to supply the oxygen gas; and
repeating supplying the metallic source compound, supplying oxygen gas and generating the plasma directly in the reactor until a metal oxide layer is formed to a desired thickness.
2. The method of claim 1 , wherein the metallic source compound is trimethylaluminum (Al(CH 3 ) 3 ), and the metal oxide layer is an aluminum oxide (Al 2 O 3 ) layer.
3. The method of claim 1 , wherein the metallic source compound is dimethoxyamidoethoxytetraethoxytantalum (Ta(OC 2 H 5 ) 4 (OC 2 H 4 N(CH 3 ) 2 )) or ethoxytantalum (Ta(OC 2 H 5 ) 5 ), and the metal oxide layer is a tantalum oxide (Ta 2 O 5 ) layer.
4. A method of forming a strontium titanate oxide (STO) layer on a substrate in a reactor using plasma in the reactor of an atomic layer deposition apparatus, the method comprising:
(5-1) supplying a strontium-based organometallic compound into the reactor;
(5-2) supplying oxygen gas into the reactor and generating oxygen plasma for a first reaction time period;
(5-3) supplying a titanium-based organometallic compound into the reactor;
(5-4) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a second reaction time period; and
(5-5) repeating said steps (5-1) through (5-4) one or more times until a strontium titanate oxide (STO) layer is formed to a desired thickness, wherein oxygen gas is continually supplied into the reactor between each of the organometallic compound supply steps and the subsequent first and second reaction time periods.
5. A method of forming a barium strontium titanate (BST) layer on a substrate in a reactor using plasma in the reactor of an atomic layer deposition apparatus the method comprising:
(6-1) supplying a barium-based organometallic compound into the reactor;
(6-2) supplying oxygen gas into the reactor and generating oxygen plasma for a first reaction time period;
(6-3) supplying a titanium-based organometallic compound into the reactor;
(6-4) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a second reaction time period;
(6-5) supplying a strontium-based organometallic compound into the reactor;
(6-6) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a third reaction time period;
(6-7) supplying a titanium-based organometallic compound into the reactor;
(6-8) supplying oxygen gas into the reactor and, thereafter, generating oxygen plasma directly in the reactor for a fourth reaction time period; and
(6-9) repeating said steps (6-1) through (6-8) until a barium strontium titanate (BST) layer is formed to a desired thickness,
wherein oxygen gas is continually supplied into the reactor between each of the organometallic compound supply steps and the subsequent one of the first, second, third and fourth reaction time periods.
6. A method of forming a strontium bismuth tantalate (SBT) layer on a substrate in a reactor using plasma in the reactor of an atomic layer deposition apparatus, the method comprising:
(7-1) supplying a strontium-based organometallic compound into the reactor;
(7-2) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a first reaction time period;
(7-3) supplying a bismuth-based organometallic compound into the reactor;
(7-4) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a second reaction time period;
(7-5) supplying a tantalum-based organometallic compound into the reactor;
(7-6) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a third reaction time period;
(7-7) supplying a bismuth-based organomtallic compound into the reactor;
(7-8) supplying oxygen gas into the reactor and, thereafter, generating oxygen plasma directly in the reactor for a fourth reaction time period;
(7-9) supplying a tantalum-based organometallic compound into the reactor;
(7-10) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a fifth reaction time period; and
(7-11) repeating the steps (7-1) through (7-10) until a barium strontium titanate (BST) layer is formed to a desired thickness,
wherein oxygen gas is continually supplied into the reactor between each of the organometallic compound supply steps and the subsequent one of the first, second, third, fourth and fifth reaction time periods.
7. A method of forming a strontium bismuth tantalate (SBT) layer on a substrate in a reactor using plasma in the reactor of an atomic layer deposition apparatus, the method comprising:
(8-1) supplying a bismuth-based organometallic compound into the reactor;
(8-2) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a first reaction time period;
(8-3) supplying an organometallic compound containing strontium and tantalum in a ratio of 1:2 into the reactor;
(8-4) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a second reaction time period; and
(8-5) repeating the steps (8-1) through (8-4) until a barium strontium titanate (BST) layer is formed to a desired thickness,
wherein oxygen gas is continually supplied into the reactor between each of the organometallic compound supply steps and the subsequent one of the first and second reaction time periods.
8. A method of forming a lead zirconate titanate (PZT) layer on a substrate in a reactor using plasma in the reactor of an atomic layer deposition apparatus, the method comprising:
(9-1) supplying a lead-based organometallic compound into the reactor;
(9-2) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a first reaction time period;
(9-3) supplying a zirconium-based organometallic compound into the reactor;
(9-4) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a second reaction time period;
(9-5) supplying a lead-based organometallic compound into the reactor;
(9-6) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a third reaction time period;
(9-7) supplying a titanium-based organometallic compound into the reactor;
(9-8) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a fourth reaction time period; and
(9-9) repeating the steps (9-1) through (9-8) above until a barium strontium titanate (BST) layer is formed to a desired thickness,
wherein oxygen gas is continually supplied into the reactor between each of the organometallic compound supply steps and the subsequent one of the first, second, third and fourth reaction time periods.
9. A method of forming a zirconium silicate (Zr—S—O) layer on a substrate in a reactor using plasma in the reactor of an atomic layer deposition apparatus, the method comprising:
(10-1) supplying a zirconium-based organometallic compound into the reactor;
(10-2) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a first reaction time period;
(10-3) supplying a silicon-based compound into the reactor;
(10-4) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a second reaction time period; and
(10-5) repeating the steps (10-1) through (10-4) until a zirconium silicate (Zr—Si—O) layer is formed to a desired thickness,
wherein oxygen gas is continually supplied into the reactor between each of the organometallic or silicon-based compound supply steps and the subsequent one of the first and second reaction time periods.
10. A method of forming a hafnium silicate (Hf—S—O) layer on a substrate in a reactor using plasma in the reactor of an atomic layer deposition apparatus, the method comprising:
(11-1) supplying a hafnium-based organometallic compound into the reactor;
(11-2) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a first reaction time period;
(11-3) supplying a silicon-based compound into the reactor;
(11-4) supplying oxygen gas into the reactor and generating oxygen plasma directly in the reactor for a second reaction time period; and
(11-5) repeating steps (11-1) through (11-4) above until a hafnium silicate (Hf—Si—O) layer is formed to a desired thickness,
wherein oxygen gas is continually supplied into the reactor between each of the organometallic or silicon-based compound supply steps and the subsequent one of the first and second reaction time periods.