IP Library Granted Patent US 6,858,891
Granted Patent B2
US 6,858,891 · App. 10/315,511 · Granted Feb 22, 2005

Nanotube semiconductor devices and methods for making the same

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Quick Facts
Patent No.
US 6,858,891
App. No.
10/315,511
Granted
Feb 22, 2005
Kind
B2
Abstract

Provided herein are vertical nanotube semiconductor devices and methods for making the same. An embodiment of the semiconductor devices comprises a vertical transistor/capacitor cell including a nanotube. The device includes a vertical transistor and a capacitor cell both using a single nanotube to form the individual devices.

Claims (79)

1. A DRAM cell comprising:

a vertical transistor including a gate, source, drain, and channel wherein a nanotube forms the channel; and

a capacitor having a ground plate, an insulator, and a charge plate wherein the nanotube forms the charge plate.

2. The device of claim 1 wherein, the gate comprises a conductive ring about an insulated exterior section of the nanotube.

3. The device of claim 1 wherein, the source comprises a conductive ring about the exterior of the nanotube.

4. The device of claim 3 wherein, the source directly, physically contacts the nanotube.

5. The device of claim 1 wherein, the nanotube is substantially orthogonal to a substrate upon which the device is formed.

6. The device of claim 1 wherein, the nanotube is a carbon nanotube.

7. A vertical transistor in a memory cell device, the vertical transistor comprising:

a substrate;

at least one nanotube connected substantially orthogonal to the substrate;

a source and drain formed on the substrate;

a conductive ring formed about an insulated exterior section of the nanotube, the conductive ring forming the gate of the vertical transistor; and

wherein the nanotube forms a channel of the vertical transistor.

8. The device of claim 7 wherein, the memory cell device includes a capacitor having a capacitor cell formed by the nanotube and the nanotube is formed of carbon.

9. A memory cell capacitor comprising:

a substrate having a first surface defining a plane;

at least one nanotube connected substantially vertically to the substrate in relation to the plane;

a ground cell plate formed on an exterior wall of the nanotube; and

wherein the nanotube forms a cell of the capacitor.

10. A semiconductor device comprising:

a substrate having a first surface;

an insulator formed on the first surface of the substrate;

a nanotube connected substantially perpendicular to the substrate;

alternating layers of insulative material, and conductive material formed about an exterior wall of the nanotube, wherein the conductive layers form gates for multiple transistors; and

wherein the nanotube forms an interconnection between the gates of the multiple transistors.

11. A semiconductor device having an electrical interconnect comprising:

a substrate having a first surface defining a plane;

a first trace formed on a portion of the substrate;

a nanotube having a first end connected to the first trace, the nanotube being substantially vertical in relation to the plane defined by the first surface of the substrate;

a second trace connected to a second end of the nanotube; and

wherein the nanotube forms an electrical connection between the first trace and the second trace.

12. The device of claim 11 wherein, the nanotube has about a 6 kohm resistance between the first trace and the second trace.

13. The device of claim 11 further comprising plural nanotubes.

14. A semiconductor device comprising:

a substrate;

a first insulation layer formed on the substrate;

at least one nanotube connected substantially orthogonal to the first insulation layer;

a first conductive ring encircling a first end of the nanotube, the first conductive ring providing electrical connection from the nanotube to the substrate;

a second insulation layer formed on the first conductive ring;

a second conductive ring formed about an insulated exterior section of the nanotube, the second conductive ring electrically connected to the substrate;

a third insulation layer formed on the second conductive ring;

a third conductive ring encircling a second end of the nanotube, the third conductive ring providing electrical connection of the second end of the nanotube to the substrate; and

a fourth insulation layer formed over the third conductive ring.

15. The device of claim 14 , wherein the nanotube comprises a carbon nanotube.

16. A semiconductor device comprising:

a substrate;

a first insulation layer formed on the substrate;

at least one nanotube connected substantially orthogonal to the first insulation layer;

a first conductive ring encircling and physically contacting an exterior wall of a first end of the nanotube, the first conductive ring providing electrical connection from the nanotube to the substrate;

a second insulation layer formed on the first conductive ring;

a second conductive ring encircling a first insulated exterior section of the nanotube, the second conductive ring electrically connected at a first end to the substrate;

a third insulation layer formed on the second conductive ring;

a third conductive ring encircling and physically contacting a second insulated exterior section of the nanotube, the third conductive ring electrically connected at a first end to the substrate;

a fourth insulation layer formed on the third conductive ring;

a fourth conductive ring encircling and physically contacting an exterior wall of a second end of the nanotube, the fourth conductive ring providing electrical connection of the second end of the nanotube to the substrate; and

a fifth insulation layer formed on the fourth conductive ring.

17. The device of claim 16 , wherein the nanotube comprises a carbon nanotube.

18. A semiconductor device comprising:

a substrate;

a first insulation layer formed on the substrate;

at least one nanotube connected substantially orthogonal to the first insulation layer;

a first conductive ring encircling and physically contacting an exterior wall of a first end of the nanotube, the first conductive ring providing electrical connection from the nanotube to the substrate;

a second insulation layer formed on the first conductive ring;

a second conductive ring encircling and physically contacting an insulated exterior section of the nanotube, the second conductive ring electrically connected at a first end to the substrate;

a third insulation layer formed on the second conductive layer; and

a conductive layer on the third insulation layer, the conductive layer forming a capacitor ground cell plate, the ground cell plate electrically connected to the substrate.

19. The device of claim 18 , wherein the nanotube comprises a carbon nanotube.

20. A memory cell comprising:

a vertical transistor including a gate, source, drain, and channel wherein a nanotube forms the channel; and

a capacitor.

21. The memory cell of claim 20 , wherein the nanotube forms a cell of the capacitor.

22. A semiconductor memory device comprising:

a substrate having electrical circuitry formed thereon;

a plurality of nanotubes connected substantially orthogonal to the substrate;

a conductive ring about the exterior of the nanotubes, the conductive ring providing electrical connection from the nanotubes to the electrical circuitry on the substrate; and

wherein the nanotubes form a cell of a capacitor and a channel of a transistor.

23. The device of claim 7 , wherein the device includes a plurality of nanotubes.

24. The device of claim 11 , wherein the device includes a plurality of nanotubes.

Assignments (6)
RELEASE OF U.S. PATENT AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Oct 12, 2018
From: ROYAL BANK OF CANADA, AS LENDER
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
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U.S. PATENT SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Sep 9, 2014
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CPPIB CREDIT INVESTMENTS INC., AS LENDER; ROYAL BANK OF CANADA, AS LENDER
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CHANGE OF ADDRESS Recorded Sep 3, 2014
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 033678/0096 →
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2014
From: ROYAL BANK OF CANADA
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.; CONVERSANT IP N.B. 868 INC.; CONVERSANT IP N.B. 276 INC.
Reel/Frame 033484/0344 →
CHANGE OF NAME Recorded Mar 13, 2014
From: MOSAID TECHNOLOGIES INCORPORATED
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
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U.S. INTELLECTUAL PROPERTY SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) - SHORT FORM Recorded Jan 10, 2012
From: 658276 N.B. LTD.; 658868 N.B. INC.; MOSAID TECHNOLOGIES INCORPORATED
To: ROYAL BANK OF CANADA
Reel/Frame 027512/0196 →