Packaged integrated circuit having wire bonds and method therefor
View Patent ↗An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. The package substrate also has vias that are present to provide electrical connection between the top and bottom sides. The vias have a via capture pad that is used to directly receive a wire bond. Thus, the wires from the integrated circuit to the top side directly contact the vias at their capture pads. In such a connection there is then no need for a trace from location where the wire is bonded on the top side to the via. This saves cost. Further this makes the package substrate useful for more than one type of integrated circuit.
1. An integrated circuit on a package substrate, comprising:
a first integrated circuit pad on the integrated circuit;
a first via in the package substrate;
a first wire having a first end bonded to the first integrated circuit pad and having a second end bonded directly to the first via, wherein neither a wire bond finger nor a trace is interposed between the second end of the first wire and the first via and wherein the first wire comprises an outer insulating layer;
a second integrated circuit pad on the intergrated circuit;
a second via in the package substrate;
a second wire having a first end bonded to the second integrated circuit pad and having a second end bonded directly to the second via, wherein neither a wire bond finger nor a trace is interposed between the second end of the second wire and the second via, and wherein the first wire crosses the second wire; and
a molding compound encapsulating the first wire, the second wire, the first via, the second via, the first intergrated circuit pad, and the second intergrated circuit pad.
2. An integrated circuit on a package substrate as in claim 1 , wherein the first via comprises a via capture pad portion, and wherein the second end of the first wire is bonded to the via capture pad portion of the first via.
3. An integrated circuit on a package substrate as in claim 2 , wherein a shape of the via capture pad portion is circular from a top view.
4. An integrated circuit on a package substrate as in claim 1 , wherein the package substrate is a ball grid array (BGA) substrate.
5. An integrated circuit on a package substrate as in claim 1 , wherein a diameter of the first wire is greater than 25.5 microns.
6. An integrated circuit on a package substrate as in claim 1 , wherein at least one of said first integrated circuit pad and said second integrated circuit pad overlies active circuit area on the integrated circuit.
7. An integrated circuit on a package substrate, comprising:
a first plurality of integrated circuit pads on the integrated circuit;
a first plurality of vias in the package substrate;
a first plurality of wires, wherein each one of the first plurality of wires has a first end bonded to one of the first plurality of integrated circuit pads and has a second end bonded directly to one of the first plurality of vias with neither a trace nor a wire bond finger interposed therebetween, wherein the first plurality of wires cross each other, and wherein the first plurality of wires are characterized as comprising an insulating layer; and
a molding compound encapsulating the first plurality of intergrated circuit pads, the first plurality of vias, and the first plurality of wires.
8. An integrated circuit on a package substrate as in claim 7 , wherein the second end of at least two of the first plurality of wires can be bonded directly to a same one of the first plurality of vias.