Semiconductor device with terminals, and method of manufacturing the same
View Patent ↗A plurality of semiconductor chips is mounted on a surface of a substrate to be used for manufacturing semiconductor devices. The semiconductor chips are collectively sealed with resin, thereby forming resin-sealed sections. A plurality of solder balls are formed on the back surface of the substrate such that an interval A between the closest solder balls of adjacent semiconductor chips becomes “n” times (“n” is an integer greater than 1) an interval B between the solder balls on the semiconductor chip. After the semiconductor chips have been subjected to an electrical test, the resin-sealed sections and the substrate are sliced, thus breaking the semiconductor chips into pieces.
1. A method of manufacturing a semiconductor device, comprising the steps of:
providing a substrate having a front surface, a back surface opposite the fornt surface, the substrate having a first set of terminals formed on the back surface and a second set of terminals formed on the bac surface, wherein an interval between adjacent first and second sets of terminals is an integral multiple of an interval between terminals of the first set of terminals;
mounting a first semiconductor chip on the front surface and electrically connected with the first set of terminals,
mounting a second semiconductor chip on the front surface and electrically connected with the second set of terminals;
collectively sealing the first semiconductor chip and the second semiconductor chip with resin to form a resin covered structure;
electrically testing the first semiconductor chip and the second semiconductor chip by contacting a test tool with the first terminals and the second terminals;
slicing twice the substrate and the sealing resin between the first terminals and the second terminals so as to separate the resin covered structure into a first semiconductor device having the first semiconductor chip and the first terminals, a second semiconductor device having the second semiconductor chip and the second terminals, and a residual remainder of the structure between the first semiconductor device and the second semiconductor device.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein the first set of terminals and the second set of terminals comprise solder balls to serve as terminals for external electrodes.
3. The method of manufacturing a semiconductor device according to claim 1 , wherein the slicing step comprises cutting the substrate and the sealing resin twice by a dicer.