IP Library Granted Patent US 7,050,322
Granted Patent B2
US 7,050,322 · App. 10/360,840 · Granted May 23, 2006

Device integrating a nonvolatile memory array and a volatile memory array

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Quick Facts
Patent No.
US 7,050,322
App. No.
10/360,840
Granted
May 23, 2006
Kind
B2
Abstract

An integrated device including a first memory array having first memory cells of a nonvolatile type and a second memory array having second memory cells of a volatile type (DRAM). The first memory cells and the second memory cells are formed in a substrate of semiconductor material, and each includes a respective MOS transistor which is formed in an active region of the substrate and has a first conductive region and a respective capacitor which is formed on top of the active region and has a first electrode and a second electrode, which are separated by a dielectric region. Moreover, the first electrode of the capacitor is connected to the first conductive region of the MOS transistor. The first and the second memory cells have a structure that is substantially the same and are formed simultaneously.

Claims (31)

1. An integrated circuit, comprising:

a first rewritable memory cell having a first storage capacitor and configured to operate only as a nonvolatile memory cell; and

a second memory cell having a second storage capacitor and configured to operate as a volatile memory cell wherein:

the first storage capacitor comprises a first ferro-electric layer; and

the second storage capacitor comprises a second ferro-electric layer that is thicker than the first ferro-electric layer.

2. The integrated circuit of claim 1 wherein the first and second storage capacitors each comprise a respective ferro-electric capacitor.

3. The integrated circuit of claim 1 wherein:

the first storage capacitor comprises a first dielectric; and

the second storage capacitor comprises a second dielectric that is thicker than the first dielectric.

4. The integrated circuit of claim 1 wherein the nonvolatile memory cell has a structure that is the same as the structure of the volatile memory cell.

5. A method, comprising:

in a mode of operation, storing data in a first memory cell on an integrated circuit in a nonvolatile manner by applying a first voltage to the cell, the absolute value of the first voltage exceeding an absolute value of a switching voltage of the first cell, the first memory cell having one and only one capacitor;

in the same mode of operation, storing different data in the first memory cell in a nonvolatile manner; and

in the same mode of operation, storing data in a second memory cell on the integrated circuit in a volatile manner by applying a second voltage to the cell, the absolute value of the second voltage being less than an absolute value of the switching voltage of the second cell.

6. The method of claim 5 wherein the first and second memory cells each comprise a respective ferro-electric capacitor.

7. The integrated circuit of claim 4 wherein the second memory cell is configured to operate only as a volatile memory cell.

8. A method for reading/writing a memory having a plurality of cells including a capacitor, which is formed by a first electrode, a second electrode, and by a ferro-electric material set between said first electrode and said second electrode, the method comprising the steps of:

during an operational mode of the memory, reading/writing a first one of said cells in a volatile manner by,

bringing said first cell into a first stable state, and

supplying to said first cell a read/write voltage in absolute value lower than switching voltages of said cell, said first cell having one and only one capacitor; and

during the same operational mode of the memory, reading/writing a second one of said cells in a nonvolatile manner by,

bringing said second cell into a first stable state, and

supplying to said second cell a read/write voltage in absolute value higher than switching voltages of said second cell, said second cell having one and only one capacitor.

9. A method, comprising:

during a mode of operation, storing data in a first memory cell in a nonvolatile manner, the first memory cell disposed on an integrated circuit and including a nonvolatile storage capacitor having a portion that is disposed in a layer of the integrated circuit;

during the same mode of operation, storing different data in the first memory cell in a nonvolatile manner; and

during the same mode of operation, storing data in a second memory cell in a volatile manner, the second memory cell disposed on the integrated circuit and including a volatile storage capacitor having a portion that is disposed in the layer of the integrated circuit.

10. A method, comprising:

in a mode of operation, storing data in a first memory cell on an integrated circuit in a nonvolatile manner by applying a first voltage to the cell, the absolute value of the first voltage exceeding an absolute value of a switching voltage of the first cell;

in the same mode of operation, storing different data in the first memory cell in a nonvolatile manner; and

in the same mode of operation, storing data in a second memory cell on the integrated circuit in a volatile manner by applying a second voltage to the cell, the absolute value of the second voltage being less than an absolute value of the switching voltage of the second cell, the second memory cell having one and only one capacitor.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2013
From: STMICROELECTRONICS, S.R.L. (FORMERLY KNOWN AS SGS-THMSON MICROELECTRONICS S.R.L.)
To: MICRON TECHNOLOGY, INC.
Reel/Frame 031796/0348 →