Method for wafer position data retrieval in semiconductor wafer manufacturing
View Patent ↗Semiconductor products, especially semiconductor wafers, are processed according to a defined sequence of orders with the products arranged in a container. Product processing data of product processing steps are stored with reference to product position data identifying product positions in the product containers. When the position of products in a container is required, a product handling order is defined and integrated in the predefined sequence of orders thereby resulting in an extended sequence of orders. The product processing steps and the product handling step are executed in compliance with the extended sequence of orders and product position change data are stored. All slot-related semiconductor processing information are thereby automatically brought in conformity with the actual material flow in cases where handling steps are executed that change the semiconductor positions upon irregular processing execution.
1. A method for processing semiconductor products, which comprises:
predefining a sequence of orders and executing product processing steps with product processing tools;
during regular processing, executing the product processing steps in compliance with the predefined sequence of orders;
thereby transporting a multiplicity of products to be processed in product containers; and
storing product processing data of product processing steps with reference to product position data identifying product positions in the product containers and to product identification codes;
upon improper processing performance requiring an unforeseen product handling step of changing one of a number and a position of a semiconductor product in one or more product containers:
defining a product handling order and integrating the product handling order in the predefined sequence of orders, to form an extended sequence of orders;
executing the product processing steps and the product handling step in compliance with the extended sequence of orders; and
storing product position change data corresponding to the integrated product handling step.
2. The method according to claim 1 , which comprises inserting the product handling order between two product processing orders of the predefined sequence of orders.
3. The method according to claim 1 , which comprises inserting the product handling order after partial execution of a product processing step being interrupted, thereby creating an order for residual execution of the interrupted product processing order.
4. The method according to claim 1 , which comprises defining further product processing orders and integrating the further product processing orders in the order list together with the product handling order.
5. The method according to claim 4 , wherein the further product processing orders are product reprocessing orders.
6. The method according to claim 1 , which comprises executing the orders with a multitude of product processing tools and handling devices, and defining handling orders to be executable by anyone of the handling devices.
7. The method according to claim 6 , which comprises remotely defining and executing handling steps to render an operator at each processing tool capable of defining and integrating the handling order executable by any handling device.
8. The method according to claim 1 , wherein that the semiconductor products are semiconductor wafers arranged in respective slots of the product containers.
9. The method according to claim 1 , wherein the handling step is performed by a mapper or a sorter.
10. The method according to claim 9 , wherein the handling step is at least one of a splitting, merging, sorting, and transferring operation.
11. The method according to claim 1 , which comprises storing processing data and position data for each semiconductor product in a semiconductor history data file.