Alternating aperture phase shift photomask having light absorption layer

1. A blank alternating aperture phase shift photomask comprising:

a photosensitive resist material layer;

an opaque layer underlying said photosensitive resist material layer;

a partially absorbing film layer underlying said opaque layer; and

a substantially transparent substrate underlying said partially absorbing film layer, wherein said partially absorbing film layer comprises a thickness which substantially balances an aerial image intensity of light transmitted through patterned regions when said blank photomask has been processed into an alternating aperture phase shift photomask, wherein

said patterned regions comprise at least one opening exposing said partially absorbing film layer, and

at least one light transmitting opening in which said partially absorbing film layer has been removed.

2. The blank alternating aperture phase shift photomask of claim 1 , wherein said partially absorbing film layer reduces the light transmitted therethrough when exposed to an energy source.

3. The blank alternating aperture phase shift photomask of claim 1 , wherein said partially absorbing film layer is made from material selected from the group consisting of: MgF 2 , amorphous Si, Si 3 N 4 , SiON, CrO, CrON, TiN, TiO, TaO, TaN, MoO, MoN and MoON.

4. The blank alternating aperture phase shift photomask of claim 1 , wherein said partially absorbing film layer is made from material selected from the group consisting of: an oxide, nitride, fluoride and oxynitride of a metallic element.

5. The blank alternating aperture phase shift photomask of claim 1 , wherein said substantially transparent substrate comprises quartz and said opaque layer comprises chromium.

6. A method for creating an alternating aperture phase shift photomask from a blank photomask comprising the steps of:

providing a blank photomask comprising a photosensitive resist material layer, an opaque layer underlying said photosensitive resist material layer, a partially absorbing film layer underlying said opaque layer, and a substantially transparent substrate underlying said partially absorbing film layer;

forming in said blank photomask at least one opening which partially absorbs light, wherein said light absorbing opening exposes said partially absorbing film layer; and

forming at least one light transmitting opening in said blank photomask, wherein said light transmitting opening exposes a portion of said substantially transparent substrate, wherein said partially absorbing film layer comprises a thickness which substantially balances an aerial image intensity of light transmitted through said at least one partially absorbing opening with light transmitted through said at least one light transmitting opening.

7. The method of claim 6 , wherein said step of forming said at least one light transmitting opening and said at least one partially absorbing opening further comprises the steps of

removing at least two portions of said opaque layer thereby exposing said partially absorbing layer underlying said at least two portions of said opaque layer; and

removing at least one portion of said partially absorbing film layer corresponding to at least one portion of said two portions of said removed opaque layer; and

etching to a predetermined depth at least one portion of said substantially transparent substrate underlying said removed partially absorbing film layer.

8. The method of claim 6 , wherein said step of forming said partially transmissive and partially absorbing opening further comprises the steps of:

exposing said photosensitive resist to an energy source;

removing said exposed photosensitive resist; and

removing portions of said opaque layer underlying said removed photoresist, thereby exposing said absorbing film.

9. The method of claim 6 , wherein said step of forming said light transmitting opening further comprises the steps of:

re-coating said opaque layer and said exposed absorbing film with a second coating of photosensitive resist;

exposing predefined areas of said second coating of photosensitive resist to said energy source;

removing said exposed areas of photosensitive resist;

removing portions of said opaque layer underlying said areas of removed photosensitive resist; and

etching said absorbing film and said substantially transparent layer underlying said areas of removed opaque layer to a predetermined depth.

10. The method of claim 6 , wherein said partially absorbing layer reduces the transmission of light through when exposed to an energy source.

11. The method of claim 6 , wherein said partially absorbing film layer is made from material selected from the group consisting of: MgF 2 , amorphous Si, Si 3 N 4 , SiON, CrO, CrON, TiN, TiO, TaO, TaN, MoO, MoN and MoON.

12. The method of claim 6 , wherein said partially absorbing film layer is made from material selected from the group consisting of an oxide, nitride, fluoride and oxynitride of a metallic element.

13. The method of claim 6 , wherein said substantially transparent substrate comprises quartz and said opaque layer comprises chromium.

14. The method of claim 6 , wherein said step of forming said at least one light transmitting opening and said at least one partially absorbing opening further comprises the steps of

removing at least two portions of said opaque layer thereby exposing said partially absorbing layer underlying said at least two portions of said opaque layer; and

removing at least one portion of said partially absorbing film layer corresponding to at least one portion of said two portions of said removed opaque layer.

15. An alternating aperture phase shift photomask comprising:

a substantially transparent substrate having at least one light transmitting opening formed therein;

a partially absorbing film layer covering portions of said substantially transparent substrate not defined by said at least one light transmitting opening; and

a patterned layer of opaque material affixed to said partially absorbing film, wherein said patterned layer exposes at least one portion of said underlying partially absorbing film layer, wherein said partially absorbing film layer comprises a thickness which substantially balances an aerial image intensity of light transmitted through said at least one exposed portion of said at least one partially absorbing film layer with light transmitted through said at least one light transmitting opening.

16. The alternating aperture phase shift photomask of claim 15 , wherein said at least one exposed portion of said partially absorbing film alternates with said at least one light transmitting opening.

17. The alternating aperture phase shift photomask of claim 15 , wherein said partially absorbing film layer is tuned to reduce the transmission of light through when exposed to an energy source.

18. The alternating aperture phase shift photomask of claim 15 , wherein said partially absorbing film layer is made from material selected from the group consisting of: MgF 2 , amorphous Si, Si 3 N 4 , SiON, CrO, CrON, TiN, TiO, TaO, TaN, MoO, MoN and MoON.

19. The alternating aperture phase shift photomask of claim 15 , wherein said partially absorbing film layer is made from material selected from the group consisting of an oxide, nitride, fluoride and oxynitride of a metallic element.

20. The alternating aperture phase shift photomask of claim 15 , wherein said substantially transparent substrate comprises quartz and said opaque layer comprises chromium.

21. An alternating aperture phase shift photomask comprising:

a substantially transparent substrate;

a partially absorbing film layer having at least one opening formed therein, wherein portions of said substantially transparent substrate underlying said at least one opening in said partially absorbing film layer are exposed; and

a patterned layer of opaque material affixed to said partially absorbing film layer, said patterned layer of opaque material having at least one opening which exposes underlying portions of said partially absorbing film layer, wherein said partially absorbing film layer comprises a thickness which substantially balances an aerial image intensity of light transmitted through said at least one opening in said opaque layer with light transmitted through at least one opening in said partially absorbing film layer.

22. The alternating aperture phase shift photomask of claim 21 , wherein said at least one exposed portion of said partially absorbing film layer alternates with said at least one opening is said partially absorbing film layer.

23. The alternating aperture phase shift photomask of claim 21 , wherein said partially absorbing film layer is tuned to reduce the transmission of light when exposed to an energy source.

24. The alternating aperture phase shift photomask of claim 21 , wherein said partially absorbing film layer is made from material selected from the group consisting of: MgF 2 , amorphous Si, Si 3 N 4 , SiON, CrO, CrON, TiN, TiO, TaO, TaN, MoO, MoN and MoON.

25. The alternating aperture phase shift photomask of claim 21 , wherein said partially absorbing film layer is made from material selected from the group consisting of an oxide, nitride, fluoride and oxynitride of a metallic element.

26. The alternating aperture phase shift photomask of claim 21 , wherein said substantially transparent substrate comprises quartz and said opaque layer comprises chromium.