IP Library Granted Patent US 6,864,698
Granted Patent B2
US 6,864,698 · App. 10/396,589 · Granted Mar 8, 2005

Hybrid cooling system for automatic test equipment

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Quick Facts
Patent No.
US 6,864,698
App. No.
10/396,589
Granted
Mar 8, 2005
Kind
B2
Abstract

Automatic test equipment is disclosed including a console and a testhead cooled by a hybrid cooling system. The testhead includes a card cage assembly having a plurality of slots disposed in spaced-apart relationship and adapted for receiving a plurality of electronic board assemblies. The hybrid cooling system includes a first cooling assembly coupled to the card cage assembly for distributing a first cooling medium proximate the electronic board assemblies and a second cooling assembly. The second cooling assembly is disposed proximate the card cage assembly and includes user-activatable cooling ports for selective access to a second cooling medium for the electronic board assemblies.

Claims (38)

1. Automatic test equipment including:

a console;

a testhead coupled to the console, the testhead including a card cage assembly having a plurality of slots disposed in spaced-apart relationship, the plurality of slots adapted for receiving a plurality of electronic board assemblies; and

a hybrid cooling system including

a first cooling assembly coupled to the card cage assembly for distributing a first cooling medium proximate the electronic board assemblies; and

a second cooling assembly disposed proximate the card cage assembly and including user-activatable cooling ports for selective access to a second cooling medium for the plurality of electronic board assemblies.

2. Automatic test equipment according to claim 1 wherein:

the first cooling system includes a fan, and the first cooling medium comprises a gas.

3. Automatic test equipment according to claim 2 wherein:

the gas comprises air.

4. Automatic test equipment according to claim 1 wherein:

a portion of the plurality of electronic assemblies include circuit boards requiring liquid cooling.

5. Automatic test equipment according to claim 1 wherein:

a portion of the plurality of electronic assemblies include circuit boards requiring only air cooling.

6. Automatic test equipment according to claim 1 wherein:

the circuit boards requiring liquid cooling are adapted to receive the liquid cooling medium, and include couplers for engaging the access ports.

7. Automatic test equipment according to claim 1 wherein:

the second cooling medium comprises a liquid.

8. Automatic test equipment according to claim 7 wherein:

the liquid comprises HFE.

9. Automatic test equipment according to claim 1 wherein the card cage assembly comprises:

a first card cage; and

a second card cage disposed serially with the first card cage, the first and second card cages cooperating to form a linear coolant path.

10. Automatic test equipment according to claim 9 and further including:

a heat exchanger interposed between the first and second card cages in the linear coolant path.

11. Automatic test equipment including:

a console;

means for housing a plurality of electronic board assemblies; and

means for cooling the plurality of electronic board assemblies with a combination of air and liquid cooling media;

wherein the means for housing a plurality of electronic board assemblies comprises a testhead coupled to the console, the testhead including a card case assembly having a plurality of slots disposed in spaced-apart relationship, the plurality of slots adapted for receiving a plurality of electronic board assemblies.

12. Automatic test equipment including:

a console;

means for housing a plurality of electronic board assemblies; and

means for cooling the plurality of electronic board assemblies with a combination of air and liquid cooling media;

wherein the means for cooling the plurality of electronic board assemblies comprises:

a hybrid cooling system including

a first cooling assembly coupled to the card cage assembly for distributing a first cooling medium proximate the electronic board assemblies; and

a second cooling assembly disposed proximate the card cage assembly and including user-activatable cooling ports for selective access to a second cooling medium for the plurality of electronic board assemblies.

Assignments (6)
SECURITY INTEREST Recorded May 7, 2020
From: TERADYNE, INC.
To: TRUIST BANK
Reel/Frame 052595/0632 →
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Jun 28, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: TERADYNE, INC.; EAGLE TEST SYSTEMS, INC.; LITEPOINT CORPORATION; NEXTEST SYSTEMS CORPORATION; GENRAD, LLC; ENERGID TECHNOLOGIES CORPORATION
Reel/Frame 049632/0940 →
PATENT SECURITY AGREEMENT Recorded Apr 27, 2015
From: TERADYNE, INC.; LITEPOINT CORPORATION
To: BARCLAYS BANK PLC
Reel/Frame 035507/0116 →
RELEASE OF SECURITY INTEREST Recorded May 13, 2009
From: BANK OF AMERICA, N.A.
To: TERADYNE, INC
Reel/Frame 022668/0750 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Dec 3, 2008
From: TERADYNE, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 021912/0762 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2003
From: MIRKHANI, RAY; MAHONEY, JOHN
To: TERADYNE INC.
Reel/Frame 013910/0837 →